H252-Z12 (rev. A00)
| 製品種別 | サーバ |
|---|---|
| CPUソケット数 | |
| CPU | |
| 筐体サイズ | 2U |
| 最大GPU数 | |
| 電源仕様 | リダンダント電源 |
| 用途/特長 | |
| 製品説明 |
AMD第3世代EPYC 7003シリーズについて
製品仕様
| Dimensions (WxHxD, mm) | 2U 4 Nodes - Rear access 440 x 87.5 x 695 |
|---|---|
| Motherboard | MZ12-HD0 Rev. 3.0 |
| CPU | AMD EPYC™ 7003 series processor family Single processor, 7nm technology Up to 64-core, 128 threads per processor TDP up to 225W, cTDP up to 240W Conditional support 280W Non-supported M.2 devices if using 280W CPU Compatible with AMD EPYC™ 7002 series processor family |
| Socket | Per Node: 1 x LGA 4094 Total: 4 x LGA 4094 Socket SP3 |
| Chipset | System on Chip |
| Memory | Per node: 8 x DIMM slots Total: 32 x DIMM slots DDR4 memory supported only 8-Channel memory architecture RDIMM modules up to 128GB supported LRDIMM modules up to 128GB supported 3DS RDIMM/LRDIMM modules up to 256GB supported Memory speed: Up to 3200 MHz |
| LAN | Per node: 2 x 1GbE LAN ports (1 x Intel® I350-AM2) 1 x Dedicated management port Total: 8 x 1GbE LAN ports (1 x Intel® I350-AM2) 4 x Dedicated management ports 1 x 10/100/1000 *CMC global management port *CMC: Chassis Management Controller, to monitor all status of computing nodes |
| Video | Integrated in Aspeed® AST2500 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp, DDR4 SDRAM Management chip on CMC board: Integrated in Aspeed® AST2520A2-GP |
| Audio | N/A |
| Storage | Per node: 3 x3.5" SATA hot-swappable SSD bays Total: 12 x 3.5" SATA hot-swappable SSD bays |
| RAID | N/A |
| Peripheral Drives | N/A |
| Expansion Slots | Per node: 1 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) 1 x Low profile half-length slots with PCIe x16 (Gen3 x16 bus) 1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported) 2 x M.2 slots: - M-key - PCIe Gen3 x4 - Supports NGFF-2242/2260/2280/22110 cards - CPU TDP is limited to 155W if using M.2 device Total: 4 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) 4 x Low profile half-length slots with PCIe x16 (Gen3 x16 bus) 4 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported) 8 x M.2 slots: - M-key - PCIe Gen3 x4 - Supports NGFF-2242/2260/2280/22110 cards - CPU TDP is limited to 155W if using M.2 device |
| Internal I/O | Per node: 2 x M.2 slot 1 x USB 3.0 header 1 x TPM header 1 x OCP 2.0 mezzanine slots 1 x Front panel header 1 x Back plane board header 1 x IPMB connector 1 x Clear CMOS jumper 1 x BIOS recovery jumper |
| Front I/O | Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED Total: 4 x Power button with LED 4 x ID button with LED 4 x Status LED *1 x CMC status LED *Only one CMC status LED per system |
| Rear I/O | Per node: 2 x USB 3.0 1 x VGA 2 x RJ45 1 x MLAN 1 x ID LED Total: 8 x USB 3.0 4 x VGA 8 x RJ45 4 x MLAN 4 x ID LEDs *1 x CMC global management port *Only one CMC global management port per system |
| Backplane I/O | 12 x ports Speed and bandwidth: SATA 6Gb/s per port |
| TPM | 1 x TPM header with SPI interface Optional TPM2.0 kit: CTM010 |
| Power Supply | 2 x 1600W redundant PSUs
80 PLUS Platinum
AC Input:
- 100-120V~/ 12A, 50-60Hz
- 200-240V~/ 10A, 50-60Hz
DC Output:
- Max 1000W/ 100-120V~
+12V/ 81.5A
+12Vsb/ 2.5A
- Max 1600W/ 200-240V or 240Vdc Input +12V/ 133A +12Vsb/ 2.5A |
| System Management | Aspeed® AST2500 management controller GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
|
| OS Compatibility | Windows Server 2016 ( X2APIC/256T not supported) Windows Server 2019 Red Hat Enterprise Linux 7.6 ( x64) or later Red Hat Enterprise Linux 8.0 ( x64) or later SUSE Linux Enterprise Server 12 SP4 ( x64) or later SUSE Linux Enterprise Server 15 SP1 ( x64) or later Ubuntu 16.04.6 LTS (x64) or later Ubuntu 18.04.3 LTS (x64) or later Ubuntu 20.04 LTS (x64) or later VMware ESXi 6.5 EP15 or later VMware ESXi 6.7 Update3 or later VMware ESXi 7.0 or later Citrix Hypervisor 8.1.0 or later |
| Weight | Net Weight: 27.3 kg Gross Weight: 45.92 kg |
| System Fans | 4 x 80x80x38mm (16,300rpm) |
| Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8%-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) Ambient temperature limited to 30°C if using 280W CPU |
| Packaging Dimensions | 1167 x 700 x 309 mm |
| Packaging Content | 1 x H252-Z12 4 x CPU heatsinks 1 x Rail Kit |
| Part Numbers | Barebone package: 6NH252Z12MR-00 Rev. A00 Spare parts: - Motherboard: 9MZ12HD0NR-00 - Rail kit: 25HB2-AN6103-K0R - CPU heatsink: 25ST1-44320J-A0R - Back plane board: 9CBPH0C3NR-00 - Power Supply: 25EP0-216008-L0S - Ring topology kit: 6NH262Z65SR-00-100 (optional extra) |
