製品情報

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SSG-221E-NE324R

製品種別 サーバ
CPUソケット数 2
CPU  
筐体サイズ 2U
最大GPU数
電源仕様 リダンダント電源
用途/特長   
製品説明 【主な特徴】
デュアル ソケット E (LGA-4677) 第 4 世代インテル® Xeon® スケーラブル プロセッサー。最大270W TDP。
2DPC で 32 個の DIMM をサポート、256GB 3DS RDIMM/RDIMM DDR5 ECC メモリの 32 個の DIMM で最大 8TB のメモリ容量をサポート
2 つの PCIe 5.0 x16 スロット、2 つの PCIe x8 スロット、および 2 つの AIOM コネクタ (OCP 3.0 SFF 準拠)
24x ホットスワップ E3.S (7.5mm) NVMe ドライブ ベイ
冗長チタン 2000W 電源

第4世代 Intel Xeon Scalable プロセッサーについて


Supermicroについて


製品仕様

Product SKUs
Product SKUs SuperServer SSG-221E-NE324R (Silver)
マザーボード
Motherboard Super X13DSF-A
Processor
CPU Dual Socket E (LGA-4677)
4th Gen Intel® Xeon® Scalable processors
Future support for the upcoming 5th Gen Intel® Xeon® processors
Note Supports 145W - 350W TDP CPUs (Air Cooled)
GPU
CPU-GPU Interconnect PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect PCIe
メモリ
Memory Memory Capacity: 32 DIMM slots
Up to 8TB: 32x 256 GB DRAM
Memory Type: 4800MHz ECC DDR5 RDIMM;LRDIMM
Chipset Intel® C741
オンボードデバイス
Network Connectivity Via AIOM
IPMI Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
マネージメント
Software IPMI 2.0
KVM with dedicated LAN
Super Diagnostics Offline
SuperDoctor® 5
Supermicro Update Manager (SUM)
Supermicro Power Manager (SPM)
Supermicro Server Manager (SSM)
Redfish API
Security
Hardware Trusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features Cryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown
システム監視機能
CPU 7 Phase-switching voltage regulator
Monitors for CPU Cores, Chipset Voltages, Memory
FAN Fans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Temperature Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Form Factor 2U Rackmount
シャーシ
Model CSE-236E3-R2K08P
外形寸法・重量
Height 3.5" (89.8mm)
Width 17.2" (438.4mm)
Depth 30.8" (789.9mm)
Package 10" (H) x 26.5" (W) x 43.25" (D)
Weight Net Weight: 55 lbs (24.95 kg)
Gross Weight: 77 lbs (34.93 kg)
Available Color Silver
拡張スロット
PCI-Express (PCIe) 1 PCIe 5.0 x8 FH slot(s)
1 PCIe 5.0 x16 FH slot(s)
1 PCIe 5.0 x8 AIOM slot(s)
1 PCIe 5.0 x16 AIOM slot(s)
ドライブベイ・ストレージ
Hot-swap 24x E3.S Hot-swap NVMe (1T) drive slots
M.2 2x PCIe 3.0 (Hybrid NVMe or SATA3)
M.3 M-Key, 2280 and 22110
冷却機構
Fans 8 Heavy Duty 8cm Fan(s)

2000W Redundant Titanium Level power supplies
Dimension(W x H x L) 73.5 x 40 x 203 mm
AC Input 1000W: 100-127Vac / 50-60Hz
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac / 50-60Hz
2000W: 220-240Vac / 50-60Hz (for UL only)
2000W: 230-240Vac / 50-60Hz
2000W: 230-240Vdc / 50-60Hz (for China only)
+12V Max: 83A / Min: 0A (100Vac-127Vac)
+13V Max: 150A / Min: 0A (200Vac-220Vac)
+14V Max: 165A / Min: 0A (220Vac-230Vac)
+15V Max: 166A / Min: 0A (230Vac-240Vac)
12V SB Max: 3.5A
Output Type Backplanes (gold finger)
Certification Titanium Level
動作環境
RoHS RoHS Compliant
Environmental Spec. Operating Temperature:  10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:8% to 90% (Non-Condensing)
Non-operating Relative Humidity:5% to 95% (Non-Condensing)

パーツ仕様

standard Parts (Parts Included)
型番 数量 内容
Motherboard / Chassis MBD-X13DSF-A 1 Super X13DSF-A Motherboard
Motherboard / Chassis CSE-236E3-R2K08P 1 2U Chassis
Add-on Card / Module AOM-DSF-IO-P 1 AOM BMC LAN/VGA/USB/COM IO Board
Backplane BPN-E3S5-236N 2 2U 12-slot PCIe Gen5 hot swappable EDSFF E3.S backplane,RoHS
Backplane BPN-SAS3-826TQ-B2B 1 2-port 2U SAS3 12Gbps backplane, support up to 2x 2.5-inch SAS3/SATA3 HDD/SSD
Cable CBL-MCIO-1422LO5Y 1
2
[NR] MCIO x8 LE to 2 ORTHO x4 1C,22cm,30AWG,RoHS
Cable CBL-PWEX-1100-25 1 MicroFit 2x2F/PH3.0 to 1x4F/PH5.08,25cm,10A/pin,16AWG,R
Cable CBL-PWEX-1142B-45 2 MicroHi (2x4F to 2x4F), PH3.0, 45cm, 8.5A/p,18#,RoHS
Cable CBL-SAST-1215X-85 1 SlimSAS (x8 to x8),STR,XMap,15cm,32#,85 Ohm,RoHS
Cable CBL-SAST-1280QT4S2-100 1 SlimSASx4 STR to 4xSATA w/2SB,80CM,100Ohm,RoHS
Air Shroud MCP-310-23601-0N 1 SC236ES Air Shroud (CPU &DIMM) modular for X13DSF-A
Software SFT-OOB-LIC 1 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0088P 2 2U Passive CPU HS for X13 Intel Eagle Stream Platform
*Power Supply PWS-2K08A-1R 2 1U 2000W 100-240VAC Titanium Ultra power supply 73.5x40x203mm
オプションパーツリスト
型番 数量 内容
Network Cards AOC-SGP-I2 - Standard LP 2-port GbE, Intel 82575
Network Cards AOC-S40G-I2Q - Standard LP 2-port 40GbE controller, Intel Fortville XL710
Network Cards AOC-S25G-M2S - Standard LP, 2x 25GbE SFP28, Mellanox ConnectX-4 LX EN
Network Cards More - AOC Compatibility Matrix (Select Storage & Generation)
Power Cord CBL-PWCD-0579-1 - Power Cord Type IEC (C14 to C13) 6 ft (14AWG), 15A, 250V
Power Cord CBL-PWCD-0300-IS - PWCD,US,IEC60320 C14 TO C13,6FT,18AWG,RoHS/REACH
Power Cord CBL-PWCD-0579 - Power Cord Type IEC (C14 to C13) 6 ft (14AWG), 15A, 250V
TPM AOM-TPM-9670V-S-O 1 TPM 2.0, vertical form factor, provisioned for server
TPM AOM-TPM-9671V-S-O 1 TPM 1.2, vertical form factor, provisioned for server