製品情報

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SYS-221H-TN24R

製品種別 サーバ
CPUソケット数 2
CPU  
 
筐体サイズ 2U
最大GPU数 1
電源仕様 リダンダント電源
用途/特長    
製品説明
主な特徴
Dual Socket E  (LGA-4677) 第4世代インテル® Xeon® スケーラブル・プロセッサー搭載
32個のDIMMスロットが最大8TBのメモリ、RDIMM最大DDR5-4800まで対応
最大8基のPCIe 5.0 x8または4基のPCIe 5.0 x16スロット(ダブルワイドGPU/アクセラレータカードに対応)をオプションで構成可能
最大2つのAIOMネットワークスロット(OCP NIC 3.0互換)による柔軟なネットワークオプション
24 x 2.5" ホットスワップ NVMe/SATA/SAS drive bays
2x 内部 M.2 NVMe/SATA drive slots
オプションでストレージアドオンカードによるRAIDをサポート
ホットスワップ対応ファン4基、最適なファン回転数制御機能付き

第4世代 Intel Xeon Scalable プロセッサーについて


Supermicroについて


製品仕様

Product SKUs
Product SKUs SYS-221H-TN24R
マザーボード
Motherboard Super X13DEM
Processor
CPU Dual Socket E (LGA-4677)
4th Gen Intel® Xeon® Scalable processors
Intel Xeon CPU Max Series with high bandwidth memory (HBM)
Note Supports up to 350W TDP CPUs (Aircooled)
Supports up to 350W TDP CPUs (Liquid Cooled)
System Memory
Memory Memory Capacity: 32 DIMM slots
Up to 8TB: 32x 256 GB DRAM
Memory Type: 4800MHz ECC DDR5
Memory Voltage 1.1 V
Error Detection ECC
On-Board Devices
Chipset Intel® C741
Network Connectivity 2x 1GbE BaseT with Intel® i350-AM2 (optional)
4x 1GbE BaseT or 4x 1GbE SFP with Intel® i350-AM4 (optional)
2x 10GbE BaseT with Intel® X550-AT2 (optional)
2x 10GbE SFP+ with Intel® X710-BM2 (optional)
4x 10GbE SFP+ with Intel® XL710-BM1 (optional)
4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional)
2x 25GbE SFP28 with Broadcom® BCM57414 (optional)
4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional)
2x 100GbE QSFP28 with Broadcom® BCM57508 (optional)
IPMI Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN 1 RJ45 Dedicated BMC LAN port
USB 2 USB 2.0 port(s) (2 rear)
Video 1 VGA port(s)
BIOS
BIOS Type AMI 256MB SPI Flash
マネージメント
Software Redfish API
IPMI 2.0
SSM
Intel® Node Manager
SPM
KVM with dedicated LAN
SUM
NMI
Watch Dog
SuperDoctor® 5
Power Configurations Power-on mode for AC power recovery
ACPI Power Management
システム監視機能
CPU Monitors for CPU Cores, Chipset Voltages, Memory
FAN Fans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Temperature Monitoring for CPU and chassis environment
Thermal Control for fan connectors
シャーシ
Form Factor 2U Rackmount
Model CSE-HS219-R1K63P
外形寸法・重量
Height 3.5" (88.9mm)
Width 17.2" (437mm)
Depth 29.9" (760mm)
Package 10.4" (H) x 23.8" (W) x 43.6" (D)
Weight Net Weight: 40 lbs (18.2 kg)
Gross Weight: 66 lbs (30 kg)
Available Color N/A
フロントパネル
Buttons Power On/Off 
UID button
LEDs HDD activity
LAN1 activity
Power status
System information
Expansion Slots
PCI-Express (PCIe) 4 (Optional) PCIe 5.0 x16 or x8 FH, 10.5"L slot(s)
4 (Optional) PCIe 5.0 x8 FH, 10.5"L slot(s)
Note For 16 NVMe configurations, PCIe slots 1,2 and AIOM slot A2 cannot be used.
For 24 NVMe configurations, PCIe slots 1,2,5,6 and AIOM slot A2 cannot be used.
Drive Bays / Storage
Hot-swap 24x 2.5" hot-swap NVMe/SATA/SAS drive bays (NVMe, SATA, or SAS support requires additional parts. Please see the Optional Parts list.)
M.2 2 M.2 NVMe OR 2 M.2 SATA3
冷却機構
Fans 4x 8cm heavy duty fans with optimal fan speed control
Air Shroud 2 Air Shroud(s)
Liquid Cooling Direct to Chip (D2C) Cold Plate (optional)
Power Supply
1600W 1U redundant power supply
Dimension(W x H x L) 73.5 x 40 x 265 mm
AC Input 1000W: 100-127Vac / 12A-9A / 50-60Hz
1600W: 200-240Vac / 9A-7.5A / 50-60Hz
+12V Max: 83.3A / Min: 0A (100Vac-127Vac)
Max: 133.3A / Min: 0A (200Vac-240Vac)
12V SB Max: 3.5A / Min: 0A
Output Type 25 Pairs Gold Finger Connector
Certification
動作環境
Environmental Spec. Operating Temperature:    10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:    -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:    8% to 90% (non-condensing)
Non-operating Relative Humidity:    5% to 95% (non-condensing)

パーツ仕様

Standard Parts (Parts Included)
型番 数量 内容
Motherboard / Chassis MBD-X13DEM 1 Super X13DEM Motherboard
CSE-HS219-R1K63P 1 2U Chassis
Add-on Card / Module AOM-HS119-IO-P 1 "Hyper IO Board,RoHS"
Backplane BPN-NVME5-HS219N-S24 1 "NVMe Gen5 24-slot direct-attached backplane, support NVMe Gen5/SAS4/SAS3/SATA HDD/SSDs.,RoHS"
Cable CBL-GNZ5-1307 1 "GNZ4C+ X16 (STR to STR),G5,7CM,85 Ohm,RoHS"
CBL-PWEX-1142-40 1 "MicroHi,(2x4 to 2x4),PH3.0,40CM,8A/pin,18AWG,RoHS"
CBL-PWEX-1142-60 1 "MicroHi,(2X4 to 2X4) P3.0,60CM,8A/pin,18AWG,RoHS"
CBL-SAST-1225LP 1 "SlimlineLP x8 (LE) to SlimlineLP x8 (RA),30CM,75/85/100,"
CBL-CDAT-0676-66 1 "[NR] FRONT CNTL,20 TO 20 PIN,PH0.5, FFC,FLAT,66CM,STD"
CBL-PWCD-0160-IS 2 "PWCD,US,NEMA5-15P TO IEC60320 C13,6FT,16AWG,RoHS/REACH"
Drive Tray(s) MCP-220-00196-0B '24' Metallic black gen-3 hot-swap 2.5 NVMe tool-less tray
Software SFT-OOB-LIC 1 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0088P 2 2U Passive CPU HS for X13 Intel Eagle Stream Platform
*Power Supply PWS-1K63A-1R 2 1U 1000W/1600W redundant single output power supply with inp
*Fan FAN-0223L4 4 "80x80x38 mm, 13.5K RPM Exhaust Fan for 2U Hyper-S(HS219),RoH"
*Front Panel FPB-FP826-T 1 Chassis front control board for SC826
オプションパーツリスト
型番 数量 内容
24 Drive Bay Configuration Options 8 NVMe for drive bays 16-23 +?16 SAS/SATA (HBA/IT Mode) via Broadcom 3816 for drive bays 0-15
(Refer to User's Manual for Part Number Info) - "8 NVMe for drive bays 16-23 +?16 SAS/SATA (HW RAID) via Broadcom 3916 (RAID 0, 1, 5, 6, 10, 50, 60) for drive bays 0-15"
Configuration 3 - 16 NVMe for drive bays 8-23 + 8 SATA via onboard Intel? PCH for drive bays 0-7
- 16 NVMe for drive bays 8-23 + 8 SAS/SATA (HBA/IT Mode) via Broadcom 3808 for drive bays 0-7
- "16 NVMe for drive bays 8-23 + 8 SAS/SATA (HW RAID) via Broadcom 3908 (RAID 0, 1, 5, 6, 10, 50, 60) for drive bays 0-7"
- 16 SAS/SATA (HBA/IT Mode) via Broadcom 3816 for drive bays 0-15 +?8 SAS/SATA (HBA/IT Mode) via Broadcom 3808 for drive bays 16-23
Configuration 1 - 24 NVMe for drive bays 0-23
- "16 SAS/SATA (HW RAID) via Broadcom 3916 (RAID 0, 1, 5, 6, 10, 50, 60) for drive bays 0-15 +?8 SAS/SATA (HW RAID) via Broadcom 3908 (RAID 0, 1, 5, 6, 10, 50, 60) for drive bays 16-23"
2nd AIOM/OCP NIC 3.0 Slot Refer to User's Manual for Part Number Info - AIOM slot A2 kit
Cable Management Arm + Rail Set MCP-290-00168-0N + MCP-290-11901-0N - "7.5"" cable management arm + 41"" long ball-bearing rail set"
Drive Tray Label LBL-0968 - "Pack of 4 ""NVMe"" labels for hot-swap drive tray"
Global Services & Support SMSAD3/2/1 - "Bronze Level,?3/2/1-year 3BD SLA"
OSNBD3/2/1 - "Silver Level, 3/2/1-year onsite NBD SLA"
OS4HR3/2/1 - "Gold Level, 3/2/1-year onsite 24x7x4 SLA"
PCIe Slots 1-2 Configuration Options Configuration 2 - "Slot 1: PCIe 5.0 x16, Slot 2: Not Available"
(Refer to User's Manual for Part Number Info) Configuration 1 - "Slot 1: PCIe 5.0 x8, Slot 2: PCIe 5.0 x8"
PCIe Slots 3-4 Configuration Options Configuration 2 - "Slot 3: PCIe 5.0 x16, Slot 4: Not Available"
(Refer to User's Manual for Part Number Info) Configuration 1 - "Slot 3: PCIe 5.0 x8, Slot 4: PCIe 5.0 x8"
PCIe Slots 5-8 Configuration Options Configuration 3 - "Slot 5: PCIe 5.0 x16, Slot 6: Not Available, Slot 7: PCIe 5.0 x16, Slot 8: Not Available"
(Refer to User's Manual for Part Number Info) Configuration 2 - "Slot 5: PCIe 5.0 x16, Slot 6: Not Available, Slot 7: PCIe 5.0 x8, Slot 8: PCIe 5.0 x8"
Configuration 1 - "Slot 5: PCIe 5.0 x8, Slot 6: PCIe 5.0 x8, Slot 7: PCIe 5.0 x8, Slot 8: PCIe 5.0 x8"
Rail Set MCP-290-21103-0N 1 "21.65"" ball-bearing rail set for Hyper servers"
MCP-290-11903-0N (included in the system ) 1 "30.5"" ball-bearing rail set for Hyper servers"
MCP-290-11902-0N 1 "35.25"" ball-bearing rail set for Hyper servers"
MCP-290-11901-0N 1 "41"" ball-bearing rail set?for Hyper servers"
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
Trusted Platform Module Options AOM-TPM-9671V-O 1 SPI capable vertical TPM 1.2
AOM-TPM-9670V-O 1 SPI capable vertical TPM 2.0
AOM-TPM-9670V-S-FIPS-O 1 AOM-TPM-9670V-S-FIPS TPM 2.0 support TAA and FIPS