製品情報

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SYS-210SE-31A

製品種別 サーバ
CPUソケット数 1
CPU  
筐体サイズ 2U
最大GPU数
電源仕様 リダンダント電源
用途/特長  
製品説明 Multi-Access Edge Computing
Flex-RAN, Open-RAN vBBU
Telecom DRAN, CRAN, and Edge Core Application
Enterprise Edge Computing

第3世代 Intel Xeon Scalable プロセッサーについて


Supermicroについて


製品仕様

Product SKUs
SYS-210SE-31A SuperServer SYS-210SE-31A (Silver)
マザーボード
Super X12SPED-F
Processor (per Node)
CPU Single Socket P+ (LGA-4189)
3rd Gen Intel® Xeon® Scalable processors
Support CPU TDP 85-205W
Please contact Supermicro Technical Support for supporting conditions of high power (TDP >205W) processors.
Cores Up to 32C/64T; Up to 48MB Cache
System Memory (per Node)
Memory Memory Capacity: 8 DIMM slots
Memory Type: 3200MHz ECC DDR4 RDIMM/LRDIMM
Memory Voltage 1.2 V
Error Detection ECC
On-Board Devices (per Node)
Chipset Intel® C621A
Network Connectivity 1x 1GbE BaseT port(s)
IPMI Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output (per Node)
LAN 1 RJ45 GbE LAN port (Shared NIC
Video 1 VGA port(s)
Serial Port 1 COM Port(s) (1 COM)
Others 1 KVM dongle (output VGA x1, COM x1, USB 2.0 x2 through KVM cable)
マネージメント
Software SuperDoctor® 5
IPMI 2.0
Power Configurations ACPI Power Management
Power-on mode for AC power recovery
システム監視機能
CPU Monitors for CPU Cores, Chipset Voltages, Memory
FAN Fans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Temperature CPU thermal trip support, PEPI
Monitoring for CPU and chassis environment
シャーシ
Form Factor 2U Rackmount
Model CSE-SE201-R2K07P
Note 16.9” (430mm) chassis depth
Front access IO design, and tool less serviceability
Three front hot-swappable nodes with single CPU socket and 8 DIMM design
外形寸法・重量
Height 3.5" (88mm)
Width 17.7" (449mm)
Depth 16.9" (430mm)
Package 9.5" (H) x 29.5" (W) x 23.2" (D)
Weight Net Weight: 55.1 lbs (25 kg)
Gross Weight: 70.6 lbs (32 kg)
Available Color Silver
フロントパネル
Buttons Power On/Off 
UID button
LEDs HDD activity
LAN1 activity
LAN2 activity
Power status
System information
Expansion Slots (per Node)
PCI-Express (PCI-E) Slot 1: 1 PCIe PCI-E 4.0 x16 LP
Slot 2: 1 PCIe PCI-E 4.0 x16 FHHL
Slot 3: 1 PCIe PCI-E 4.0 x16 FHHL
Drive Bays / Storage (per Node)
Drive Bays N/A
M.2 2 M.2 NVMe
M-Key, 2280/22110
冷却機構
Fans 12 heavy duty fans with optimal fan speed control (4 fans per node)
Air Shroud 1 Air Shroud(s)
Power Supply
Dimension(W x H x L) 73.5 x 40 x 265 mm
AC Input 1000W: 100-127Vac / 9A-12A / 50-60Hz
1800W: 200-220Vac / 9.8A-10A / 50-60Hz
2000W: 220-240Vac / 10A-11A / 50-60Hz
+12V Max: 83A / Min: 0A (100Vac-127Vac)
Max: 150A / Min: 0A (200Vac-220Vac)
Max: 166A / Min: 0A (220Vac-240Vac)
Certification
動作環境
Environmental Spec. Operating Temperature:    0°C ~ 55°C (32°F ~ 131°F)
Non-operating Temperature:    -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:    8% to 90% (non-condensing)
Non-operating Relative Humidity:    5% to 95% (non-condensing)

パーツ仕様

パーツリスト
型番 数量 内容
Motherboard / Chassis MBD-X12SPED-F CSE-SE201-R2K07P 3 1 Super X12SPED-F Motherboard 2U Chassis
Add-on Card / Module AOM-BPN-SE3N-P 1 Backplane for SuperEdge 2U3N,RoHS
Cable 1 CBL-0218L 1 11.5CM KVM/SUVI 36PIN TO 9PIN/15PIN/2USB
Riser Card RSC-W-66G4 3 1U LHS WIO Riser card with two PCI-E 4.0 x16 slots,HF,RoHS
Riser Card RSC-WR-6 3 1U RHS WIO Riser card with one PCI-E 4.0 x16 slot,HF,RoHS
Software SFT-OOB-LIC 3 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0077V 3 X12 ICX/CPX CPU Heatsink (78x113x25.5mm), VC Base, Cu Fin
*Power Supply PWS-2K07F-1R 2 1U 2000W 90-264Vac/47-63Hz, wide DC input 180Vdc-300Vdc, 12V
*Power Distributor PDB-PT201-DSG 2 Super Edge pass through board support Ultra powers up to 6KW
*Rail Set MCP-290-20101-0N 1 2U fixed rail set, quick release, default for 2,3U , 17.6"W, 18.5-22
オプションパーツリスト
型番 数量 内容
TPM security module AOM-TPM-9670V - SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor