NEW
H263-S63 (rev. AAW1)
| 製品種別 | サーバ |
|---|---|
| CPUソケット数 | 2 |
| CPU | |
| 筐体サイズ | 2U |
| 最大GPU数 | 0 |
| 電源仕様 | リダンダント電源 |
| 用途/特長 | |
| 製品説明 | 第4世代 Intel Xeon スケーラブル 2U4node高密度実装サーバー
・2U 4 ノード 背面アクセス サーバー
・第4 世代 Intel ® Xeon ®スケーラブル プロセッサ
・Intel® Xeon® CPU Maxシリーズ
・2CPU、LGA4677
・8 チャネル RDIMM DDR5、64 x DIMM(per processor)
・Intel ® Optane™ Persistent Memory 300 シリーズ をサポート
・Dual ROM アーキテクチャをサポート
・4 x 専用管理ポート
・1 x CMC グローバル管理ポート
・8 x 2.5インチ Gen4 NVMe/SATA ホットスワップ対応
・4 x M.2 (with PCIe Gen4 x4 interface) (オプション)
・8 x Low Profile PCIe Gen5 x16 拡張スロット
・4 x OCP 3.0 Gen5 x16 mezzanine slots
・2 x 3000W (240V) 80 PLUS Titanium リダンダント電源 |
第4世代 Intel Xeon Scalable プロセッサーについて
製品仕様
| Dimensions (WxHxD, mm) | 2U 4-Node - Rear access 440 x 87.5 x 840 |
|---|---|
| Motherboard | MS63-HD1 |
| CPU | 4th Generation Intel® Xeon® Scalable Processors Intel® Xeon® CPU Max Series Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor CPU TDP up to 270W NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable |
| Socket | Per Node: 2 x LGA 4677 Total: 8 x LGA 4677 Socket E |
| Chipset | Intel® C741 Chipset |
| Memory | Per node: 16 x DIMM slots Total: 64 x DIMM slots DDR5 memory supported only 8-Channel memory architecture RDIMM modules up to 128GB supported 3DS RDIMM modules up to 256GB supported Memory speed: Up to 4800 MHz |
| LAN | Per node: 1 x Dedicated management port Total: 4 x Dedicated management ports |
| Video | Integrated in Aspeed® AST2600 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp, DDR4 SDRAM Management chip on CMC board: Integrated in Aspeed® AST2520A2-GP |
| Audio | N/A |
| Storage | Per node: 2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays Total: 8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays SAS card is required for SAS devices support |
| SAS | Supported via add-on SAS Card |
| RAID | Intel® SATA RAID 0/1/10/5 |
| Peripheral Drives | N/A |
| Expansion Slots | Per node: 2 x Low profile half-length slots with PCIe x16 (Gen5 x16 bus), from CPU_0 1 x OCP 3.0 mezzanine slot with PCIe Gen5 x16 bandwidth, from CPU_0 Supported NCSI function *1 x M.2 slot from CPU_1: - M-key - PCIe Gen4 x4 - Supports NGFF-2280/22110 cards Total: 8 x Low profile half-length slots with PCIe x16 (Gen5 x16 bus), from CPU_0 4 x OCP 3.0 mezzanine slots with PCIe Gen5 x16 bandwidth, from CPU_0 Supported NCSI function *4 x M.2 slots from CPU_1: - M-key - PCIe Gen4 x4 - Supports NGFF-2280/22110 cards *Optional kit for M.2 extension riser card PN: 9CMTP061NR-00 |
| Internal I/O | Per node: 1 x TPM header |
| Front I/O | Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED 1 x System reset button Total: 4 x Power button with LED 4 x ID button with LED 4 x Status LED 4 x System reset buttons *1 x CMC status LED *1 x CMC reset button *Only one CMC status LED and reset button per system |
| Rear I/O | Per node: 2 x USB 3.2 Gen1 1 x VGA 1 x RJ45 MLAN 1 x ID button with LED Total: 8 x USB 3.2 Gen1 4 x VGA 4 x RJ45 MLAN 4 x ID button with LED *1 x CMC global management port *Only one CMC global management port per system |
| Backplane I/O | Backplane P/N: 9CBPH081NR-00 PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s |
| TPM | 1 x TPM header with SPI interface Optional TPM2.0 kit: CTM010 |
| Power Supply | Dual 3000W (240V) 80 PLUS Titanium redundant power supply Available for 2+1 redundant power supply configuration (optional) AC Input: - 100-127V~/ 16A, 50-60Hz - 200-240V~/ 16A, 50-60Hz DC Input: - 240Vdc/ 16A DC Output: - Max 1200W/ 100-127V~ + 12.2V/ 98.36A + 12.2Vsb/ 3A - Max 2600W/ 200-207V~ + 12.2V/ 213A + 12.2Vsb/ 3A - Max 3000W/ 208-240V~ + 12.2V/ 245.9A + 12.2Vsb/ 3A NOTE: The system power supply requires C19 type power cord |
| System Management | Aspeed® AST2600 management controller GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
|
| OS Compatibility | Please refer to OS compatibility table in support page |
| System Fans | 8 x 80x80x38mm (18,300rpm) |
| Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) |
| Packaging Dimensions | 1180 x 779 x 300 mm |
| Packaging Content | 1 x H263-S63 8 x CPU heatsinks 24 x Carrier clips 1 x Rail Kit |
| Part Numbers | - Barebone package: 6NH263S63DR000AAW1* - Motherboard: 9MS63HD1UR-000 - Rail kit: 25HB2-A66125-K0R - CPU heatsink: 25ST1-453207-C1R/25ST1-453208-C1R - M.2 extension riser card: 9CMTP061NR-00 (optional) - Riser card ( from CPU_1): 9CRSH310NR-00 (optional) - Back plane board: 9CBPH081NR-00 - Fan module: 25ST2-88382P-S1R/25ST2-88382Q-S1R - Riser card - CRSH01T: 9CRSH01TNR-00 - Riser card - CRSH01U: 9CRSH01UNR-00 - Ring topology kit: 6NH263S62S1000AAN11 (optional, QPA:1) - Power Supply: 25EP0-230009-L0S - C19 power cord 125V/15A (US): 25CP1-018000-Q0R (optional) - C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional) |
