製品情報

H273-Z82 (rev. AAW1)

製品種別 サーバ
CPUソケット数 2
CPU  
筐体サイズ 2U
最大GPU数 0
電源仕様 リダンダント電源
用途/特長   
製品説明 HCI Server – AMD EPYC™ 9004 DP 2U 4-Node Server 8 x Gen4 NVMe/SATA 3000W

AMD 第4世代 EPYC 9004シリーズについて


製品仕様

Dimensions (WxHxD, mm) 2U 4-Node - Rear access
440 x 87.5 x 877
Motherboard MZ83-HD0
CPU AMD EPYC™ 9004 series processor family
Dual processors, 5nm technology
Up to 96-core, 192 threads per processor
Supports CPU 400W at ambient 25°C*

NOTE: CPU 240W at ambient 25°C if using OCP 3.0 slot
Socket Per Node:
2 x LGA 6096
Total:
8 x LGA 6096

Socket SP5
Chipset System on Chip
Memory Per node:
24 x DIMM slots

Total:
96 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 128GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz
LAN Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
Supported NCSI function
1 x Dedicated management port

Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
Supported NCSI function
4 x Dedicated management ports
Video Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Audio N/A
Storage Per node:
2 x 2.5" Gen4 NVMe/ SATA/ SAS hot-swappable bays

Total:
8 x 2.5" Gen4 NVMe/ SATA/ SAS hot-swappable bays

SAS card is required for SAS devices support
SAS Supported via add-on SAS Card
RAID N/A
Peripheral Drives N/A
Expansion Slots Per node:
1 x Low profile half-length slots with PCIe x16 (Gen5 x16 bus), from CPU_0
1 x OCP 3.0 mezzanine slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supported NCSI function

*1 x M.2 slot from CPU_0:
- M-key
- PCIe Gen4 x4
- Supports NGFF-2280/22110 cards

Total:
4 x Low profile half-length slots with PCIe x16 (Gen5 x16 bus) from CPU_0
4 x OCP 3.0 mezzanine slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supported NCSI function

*4 x M.2 slots from CPU_0:
- M-key
- PCIe Gen4 x4
- Supports NGFF-2280/22110 cards

*Optional kit for M.2 extension riser card
PN: 9CMTP192NR-00
Internal I/O Per node:
1 x TPM header
Front I/O Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x System reset button
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system
Rear I/O Per node:
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x RJ45 MLAN
1 x Node Status LED

Total:
8 x USB 3.2 Gen1
4 x Mini-DP
8 x RJ45
4 x RJ45 MLAN
4 x Node Status LED
Backplane I/O Backplane P/N: 9CBPH081NR-00
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM 1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply Dual 3000W (240V) 80 PLUS Titanium redundant power supply

AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz

DC Input:
240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V
+12.2V/ 245.9A
+12.2Vsb/ 3A

NOTE: The system power supply requires C19 type power cord
System Management Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 8.6 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 15 SP4 (x64) or later

Ubuntu 20.04.5 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 7 P05 or later
VMware ESXi 8 or later

Citrix Hypervisor 8.2.1 or later
System Fans 4 x 80x80x80mm (16,500rpm)
Operating Properties Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions 1179 x 700 x 380 mm
Packaging Content 1 x H273-Z82
8 x CPU heatsinks
1 x Rail Kit
Part Numbers Barebone package: 6NH273Z82DR000AAW1*
Spare parts:
- Motherboard: 9MZ83HD0UR-000
- Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-25320P-M1R/ 25ST1-25320Q-M1R
- M.2 extension riser card: 9CMTP192NR-00 ( optional)
- Back plane board: 9CBPH081NR-00
- Rear IO board ( incl. LAN chip): 9CLBH160NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power Supply: 25EP0-230009-L0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)