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H262-P61 (rev. 100)
| 製品種別 | サーバ |
|---|---|
| CPUソケット数 | 2 |
| CPU | |
| 筐体サイズ | 2U |
| 最大GPU数 | |
| 電源仕様 | リダンダント電源 |
| 用途/特長 | |
| 製品説明 | HPC Server – Ampere Altra Max - ARM Server - DP 2U 4-Nodes | Application: HPC , HCI & Hybrid/Private Cloud Server |
製品仕様
| Dimensions (WxHxD, mm) | 2U 4 Nodes - Rear access 440 x 87.5 x 840 |
|---|---|
| Motherboard | MP62-HD0 |
| CPU | Ampere® Altra® Max or Altra® Processor Dual processors, 7nm technology Up to 128-core per processor, TDP up to 250W NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable |
| Socket | Per Node: 2 x LGA 4926 Total: 8 x LGA 4926 |
| Chipset | System on Chip |
| Memory | Per node: 16 x DIMM slots Total: 64 x DIMM slots DDR4 memory supported only 8-Channel memory per processor architecture RDIMM modules up to 256GB supported LRDIMM modules up to 256GB supported Up to 4TB of memory capacity supported per processor Memory speed: Up to 3200 MHz |
| LAN | Per node: 2 x 1GbE LAN ports (1 x Intel® I350-AM2) 1 x Dedicated management port Total: 8 x 1GbE LAN ports (1 x Intel® I350-AM2) 4 x Dedicated management ports 1 x 10/100/1000 *CMC global management port *CMC: Chassis Management Controller, to monitor all status of computing nodes |
| Video | Integrated in Aspeed® AST2600 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp, DDR4 SDRAM Management chip on CMC board: Integrated in Aspeed® AST2520A2-GP |
| Audio | N/A |
| Storage | Per node: 2 x 2.5" SATA hot-swappable HDD/SSD bays Total: 8 x 2.5" SATA hot-swappable HDD/SSD bays |
| SAS | N/A |
| RAID | N/A |
| Peripheral Drives | N/A |
| Expansion Slots | Per node: 2 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) 1 x OCP 3.0 mezzanine slot with PCIe Gen4 x8 or x16 bandwidth* 1 x M.2 slot: - M-key - PCIe Gen4 x4 - Supports 2280/22110 cards Total: 8 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) 4 x OCP 3.0 mezzanine slot with PCIe Gen4 x8 or x16 bandwidth* 4 x M.2 slots: - M-key - PCIe Gen4 x4 - Supports 2280/22110 cards NOTE: Gen4 x16 available for Ampere Altra Max processor only |
| Internal I/O | Per node: 1 x M.2 slot 1 x TPM header 1 x BMC SGPIO header 1 x JTAG BMC header 1 x PLD header 1 x Clear CMOS jumper 1 x IPMB connector |
| Front I/O | Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED 1 x System reset button Total: 4 x Power button with LED 4 x ID button with LED 4 x Status LED 4 x System reset button *1 x CMC status LED *Only one CMC status LED per system |
| Rear I/O | Per node: 2 x USB 3.2 Gen1 1 x Mini DP 2 x RJ45 1 x RJ45 MLAN Total: 8 x USB 3.2 Gen1 4 x Mini DP 8 x RJ45 4 x RJ45 MLAN *1 x CMC global management port *Only one CMC global management port per system |
| Backplane I/O | Total 8 x ports, each node handles 2 x ports Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s per port |
| TPM | 1 x TPM header with SPI interface Optional TPM2.0 kit: CTM010 |
| Power Supply | 2 x 2200W redundant PSUs
80 PLUS Platinum
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V +12.12V/ 178.1A +12Vsb/ 3.5A System power supply requires C19 type power cord |
| System Management | Aspeed® AST2600 management controller GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
|
| OS Compatibility | Red Hat Enterprise Linux 8.3 ( aarch64 ) or later Red Hat Enterprise Linux 8.5 ( aarch64 ) or later SUSE Linux Enterprise Server 15 SP2 ( aarch64 ) or later SUSE Linux Enterprise Server 15 SP3 ( aarch64 ) or later Ubuntu 18.04.5 LTS ( aarch64 ) or later Ubuntu 20.04.1 LTS ( aarch64 ) or later Ubuntu 22.04 LTS ( aarch64 ) or later Fedora Server 33-1.2 ( aarch64 ) or later Fedora Server 35-1.2 ( aarch64 ) or later OracleLinux R8 U2 OracleLinux R8 U5 Debian 10.9 (Buster) Debian 11.1 |
| System Fans | 8 x 80x80x38mm (16,300rpm) |
| Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) |
| Packaging Dimensions | 1180 x 779 x 300 mm |
| Packaging Content | 1 x H262-P61 8 x CPU heatsinks 1 x Rail Kit |
| Part Numbers | Barebone package: 6NH262P61MR-00 Spare parts: - Motherboard: 9MP62HD0NR-00 - Rail kit: 25HB2-AN6103-K0R - CPU heatsink: 25ST1-45320B-A3R/25ST1-45320C-C1R - Back plane board: 9CBPH080NR-00 - Power Supply: 25EP0-222003-D0S - C19 power cord 125V/15A (US): 25CP1-018000-Q0R (in option) - C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (in option) - Ring topology kit: 6NH262Z65SR-00-100 (in option) |
