H262-ZL0 (rev. A00)
| 製品種別 | サーバ |
|---|---|
| CPUソケット数 | 2 |
| CPU | |
| 筐体サイズ | 2U |
| 最大GPU数 | |
| 電源仕様 | シングル電源相当（2+0） |
| 用途/特長 | |
| 製品説明 | Liquid cooling solution Application: HCI & Hybrid/Private Cloud Server |
AMD第3世代EPYC 7003シリーズについて
製品仕様
| Dimensions (WxHxD, mm) | 2U 4 Nodes - Rear access 440 x 87.5 x 840 |
|---|---|
| Motherboard | MZ62-HD4 Rev. 3.0 |
| CPU | AMD EPYC™ 7003 series processor family Dual processors, 7nm technology Up to 64-core, 128 threads per processor cTDP up to 280W NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable Compatible with AMD EPYC™ 7002 series processor family |
| Socket | Per Node: 2 x LGA 4094 Total: 8 x LGA 4094 Socket SP3 |
| Chipset | System on Chip |
| Memory | Per node: 16 x DIMM slots Total: 64 x DIMM slots DDR4 memory supported only 8-Channel memory per processor architecture RDIMM modules up to 128GB supported LRDIMM modules up to 128GB supported 3DS RDIMM/LRDIMM modules up to 256GB supported Memory speed: Up to 3200 MHz |
| LAN | Per node: 2 x 1GbE LAN ports (1 x Intel® I350-AM2) 1 x Dedicated management port Total: 8 x 1GbE LAN ports (1 x Intel® I350-AM2) 4 x Dedicated management ports 1 x 10/100/1000 *CMC global management port *CMC: Chassis Management Controller, to monitor all status of computing nodes |
| Video | Integrated in Aspeed® AST2500 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp, DDR4 SDRAM Management chip on CMC board: Integrated in Aspeed® AST2520A2-GP |
| Audio | N/A |
| Storage | Per node: 6 x 2.5" Gen4 U.2 hot-swappable SSD bays 1 x M.2 slot from CPU_0: - M-key - PCIe Gen4 x4 - Supports NGFF-2280/22110 cards Total: 24 x 2.5" Gen4 U.2 hot-swappable SSD bays All storage bays are compatible with SATA devices 4 x M.2 slots from CPU_0: - M-key - PCIe Gen4 x4 - Supports NGFF-2280/22110 cards |
| SAS | N/A |
| RAID | N/A |
| Peripheral Drives | N/A |
| Expansion Slots | Per node: 1 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) from CPU_0 1 x OCP 3.0 mezzanine slot with PCIe Gen4 x16 bandwidth Total: 4 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) from CPU_0 4 x OCP 3.0 mezzanine slot with PCIe Gen4 x16 bandwidth |
| Internal I/O | Per node: 1 x M.2 slot 1 x COM header 1 x TPM header 1 x BMC SGPIO header 1 x JTAG BMC header 1 x PLD header 1 x Clear CMOS jumper 1 x IPMB connector |
| Front I/O | Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED 1 x System reset button Total: 4 x Power button with LED 4 x ID button with LED 4 x Status LED 4 x System reset button *1 x CMC status LED *1 x CMC reset button *Only one CMC status LED and reset button per system |
| Rear I/O | Per node: 2 x USB 3.0 1 x Mini-DP 2 x RJ45 1 x RJ45 MLAN 1 x ID LED Total: 8 x USB 3.0 4 x Mini-DP 8 x RJ45 4 x RJ45 MLAN 4 x ID LED *1 x CMC global management port *Only one CMC global management port per system |
| Backplane I/O | 24 x ports Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s or PCIe Gen4 x4 per port |
| TPM | 1 x TPM header with SPI interface Optional TPM2.0 kit: CTM010 |
| Power Supply | 2 x 2200W PSUs
80 PLUS Platinum
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V +12.12V/ 178.1A +12Vsb/ 3.5A System power supply requires C19 type power cord |
| System Management | Aspeed® AST2500 management controller GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
|
| OS Compatibility | Windows Server 2016 ( X2APIC/256T not supported) Windows Server 2019 Red Hat Enterprise Linux 8.3 ( x64) or later SUSE Linux Enterprise Server 12 SP5 ( x64) or later SUSE Linux Enterprise Server 15 SP2 ( x64) or later Ubuntu 18.04.5 LTS (x64) or later Ubuntu 20.04 LTS (x64) or later VMware ESXi 6.7 Update3 P03 or later VMware ESXi 7.0 Update1 or later Citrix Hypervisor 8.2.0 or later |
| System Fans | 4 x 80x80x38mm (16,300rpm) |
| Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) |
| Packaging Dimensions | 1180 X 700 X 465 mm |
| Packaging Content | 1 x H262-ZL0 1 x Liquid cooling solution kit 1 x Rail Kit |
| Part Numbers | Barebone package: 6NH262ZL0MR-00 Rev. A00 Spare parts: - Motherboard: 9MZ62HD4NR-00 - Rail kit: 25HB2-AN6103-K0R - Liquid cooling kit: 25ST7-200002-C4R ( CPU kit) - Back plane board: 9CBPH7O0NR-00 - Power Supply: 25EP0-222003-D0S - C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional extra) - C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional extra) - Ring topology kit: 6NH262Z65SR-00-100 (optional kit) |
