製品情報

H282-ZC0 (rev. A00)

製品種別 サーバ
CPUソケット数
CPU  
 
筐体サイズ 2U
最大GPU数
電源仕様 リダンダント電源
用途/特長  
製品説明

AMD第3世代EPYC 7003シリーズについて


製品仕様

Dimensions (WxHxD, mm) 2U 4 Nodes - Front access
447 x 87.5 x 902
Motherboard MZC2-LM0 Rev. 1.0
CPU AMD EPYC™ 7003 series processor family
Dual processors, 7nm technology
Up to 64-core, 128 threads per processor
cTDP up to 240W

NOTE:
If only one CPU is installed, some PCIe or memory functions might be unavailable


Compatible with AMD EPYC™ 7002 series processor family
Socket Socket SP3
Chipset System on Chip
Memory Per node:
32 x DIMM slots

Total:
128 x DIMM slots
DDR4 memory supported only
8-Channel memory per processor architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200*/ 2933 MHz

- Note:
* Follow BIOS setting and memory QVL list if running 3200 Mhz with 2DPC
LAN Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port

Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
Video Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Audio N/A
Storage Per node:
2 x 2.5" 7mm slim type NVMe/SATA hot-swappable HDD/SSD bays

Total:
8 x 2.5" 7mm slim type NVMe/SATA hot-swappable HDD/SSD bays
SAS N/A
RAID N/A
Peripheral Drives N/A
Expansion Slots Per node:
1 x Low profile half-length slot with PCIe x16 (Gen4 x16 bus) in front side (CPU_0)
2 x Full height half-length slots with PCIe x16 (Gen4 x16 bus) in rear side (CPU_1)
1 x OCP 3.0 mezzanine slot with PCIe Gen4 x16 bandwidth from CPU_0

2 x M.2 slots from CPU_0 and CPU_1:
- M-key
- PCIe Gen4 x4
- Supports NGFF-2260/2280 cards
- CPU TDP is limited to 240W if using M.2 device

Total:
4 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) in front side (CPU_0)
8 x Full height half-length slots with PCIe x16 (Gen4 x16 bus) in rear side (CPU_1)
4 x OCP 3.0 mezzanine slots with PCIe Gen4 x16 bandwidth from CPU_0

8 x M.2 slots from CPU_0 and CPU_1:
- M-key
- PCIe Gen4 x4
- Supports NGFF-2260/2280 cards
- CPU TDP is limited to 240W if using M.2 device
Internal I/O Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
2 x USB 3.0
1 x Mini-DP
2 x RJ45
1 x RJ45 MLAN

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x System reset button
8 x USB 3.0
4 x Mini-DP
8 x RJ45
4 x RJ45 MLAN
Rear I/O 2 x CMC global management ports
Backplane I/O 2 x ports per node
Speed and bandwidth: SATA 6Gb/s or PCIe Gen4 x4 per port
TPM 1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply 2 x 3000W PSUs
80 PLUS Platinum

Input:
100-127V~/ 14A
220-240V~/ 16A
Output:
1106W@100-127V
2434.5W@200-208V
2828.1W@214-234V
3234W@240V

NOTE: The system power supply requires C19 type power cord
System Management Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • JAVA Based Serial Over LAN
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility Windows Server 2016 ( X2APIC/256T not supported)
Windows Server 2019

Red Hat Enterprise Linux 8.3 ( x64) or later

SUSE Linux Enterprise Server 12 SP5 ( x64) or later
SUSE Linux Enterprise Server 15 SP2 ( x64) or later

Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later

Citrix Hypervisor 8.2.0 or later
System Fans 8 x 80x80x38mm (16,300rpm)
Operating Properties Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions 1180 X 779 X 300 mm
Packaging Content 1 x H282-ZC0
8 x CPU heatsinks
1 x Rail Kit
Part Numbers Barebone package: 6NH282ZC0MR-00 Rev. A00
Spare parts:
- Motherboard: 9MZC2LM0NR-00
- Rail kit: 25HB2-A86104-K0R
- CPU heatsink: 25ST1-423203-A0R/ 25ST1-44320J-A0R
- Back plane board: 9CBPH022NR-00
- NVMe PCIe Card: 9CNV3152NR-00
- Power Supply: 25EP0-232001-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional extra)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional extra)