H261-Z60 (rev. B00)
| 製品種別 | サーバ |
|---|---|
| CPUソケット数 | |
| CPU | |
| 筐体サイズ | 2U |
| 最大GPU数 | |
| 電源仕様 | リダンダント電源 |
| 用途/特長 | |
| 製品説明 |
AMD第3世代EPYC 7003シリーズについて
製品仕様
| Dimensions (WxHxD, mm) | 2U 4 Nodes - Rear access 440 x 87 x 820 |
|---|---|
| Motherboard | MZ61-HD0 Rev. 3.0 |
| CPU | AMD EPYC™ 7003 series processor family Dual processors, 7nm Up to 64-core, 128 threads per processor TDP up to 200W Compatible with AMD EPYC™ 7002 series processor family NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable |
| Socket | Socket SP3 |
| Chipset | System on Chip |
| Memory | Per node: 16 x DIMM slots Total: 64 x DIMM slots DDR4 memory supported only 8-Channel memory architecture RDIMM modules up to 128GB supported LRDIMM modules up to 128GB supported 3DS RDIMM/LRDIMM modules up to 256GB supported Memory speed: Up to 3200*/ 2933 MHz - Note: * Follow BIOS setting and memory QVL list if running 3200 Mhz |
| LAN | Per node: 2 x 1GbE LAN ports (1 x Intel® I350-AM2) 1 x Dedicated management port Total: 8 x 1GbE LAN ports (1 x Intel® I350-AM2) 4 x Dedicated management ports 1 x 10/100/1000 *CMC global management port *CMC: Chassis Management Controller, to monitor all status of computing nodes |
| Video | Integrated in Aspeed® AST2500 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp, DDR4 SDRAM Management chip on CMC board: Integrated in Aspeed® AST2520A2-GP |
| Audio | N/A |
| Storage | Per node: 6 x 2.5" SATA hot-swappable HDD/SSD onboard SATA ports or 4 x 2.5" SATA /SAS hot-swappable HDD/SSD with SAS RAID Card Total: 24 x 2.5" hot-swappable HDD/SSD bays SAS card is required for SAS devices support |
| SAS | N/A |
| RAID | N/A |
| Peripheral Drives | N/A |
| Expansion Slots | Per node: 2 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) from CPU_0 1 x OCP mezzanine slot with PCIe Gen3 x16 bus from CPU_0 2 x M.2 slots from CPU_0 and CPU_1: - M-key - PCIe Gen3 x4 - Supports NGFF-2242/2260/2280/22110 cards - CPU TDP is limited to 120W if using M.2 device Total: 8 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) from CPU_0 4 x OCP mezzanine slots with PCIe Gen3 x16 bus from CPU_0 8 x M.2 slots from CPU_0 and CPU_1: - M-key - PCIe Gen3 x4 - Supports NGFF-2242/2260/2280/22110 cards - CPU TDP is limited to 120W if using M.2 device |
| Internal I/O | Per node: 2 x M.2 slots 1 x COM header 1 x TPM header 1 x BMC SGPIO header 1 x JTAG BMC header 1 x PLD header 1 x Clear CMOS jumper 1 x IPMB connector |
| Front I/O | Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED Total: 4 x Power button with LED 4 x ID button with LED 4 x Status LED *1 x CMC status LED *Only one CMC status LED per system |
| Rear I/O | Per node: 2 x USB 3.0 1 x VGA 2 x RJ45 1 x RJ45 MLAN 1 x ID LED Total: 8 x USB 3.0 4 x VGA 8 x RJ45 4 x RJ45 MLAN 4 x ID LEDs *1 x CMC global management port *Only one CMC global management port per system |
| Backplane I/O | 24 x ports 12Gb/s & 6Gb/s compatible |
| TPM | 1 x TPM header with LPC interface Optional TPM2.0 kit: CTM000 |
| Power Supply | 2 x 2200W redundant PSUs
80 PLUS Platinum
AC Input: - 100-127V~/ 14A, 47-63Hz - 200-240V~/ 12.6A, 47-63Hz DC Output: - Max 1200W/ 100-127V~ +12.12V/ 95.6A +12Vsb/ 3.5A - Max 2200W/ 200-240V +12.12V/ 178.1A +12Vsb/ 3.5A NOTE: * The system power supply requires C19 type power cord * 2000W 80 PLUS Titanium PSU as an option |
| System Management | Aspeed® AST2500 management controller GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
|
| OS Compatibility | Windows Server 2016 ( X2APIC/256T not supported) Windows Server 2019 Red Hat Enterprise Linux 8.3 ( x64) or later SUSE Linux Enterprise Server 12 SP5 ( x64) or later SUSE Linux Enterprise Server 15 SP2 ( x64) or later Ubuntu 18.04.5 LTS (x64) or later Ubuntu 20.04 LTS (x64) or later VMware ESXi 6.7 Update3 P03 or later VMware ESXi 7.0 Update1 or later Citrix Hypervisor 8.2.0 or later |
| System Fans | 8 x 80x80x38mm (16,300rpm) |
| Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) |
| Packaging Dimensions | 1167 X 700 X 309 mm |
| Packaging Content | 1 x H261-Z60 8 x CPU heatsinks 1 x Rail Kit |
| Part Numbers | Barebone package: 6NH261Z60MR-00 Rev. B00 Spare parts: - Motherboard: 9MZ61HD0NR-00 Rev. 3.0 - Rail kit: 25HB2-NJ2102-N1R/ 25HB2-AN6103-K0R - CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R - Back plane board: 9CBPH0O0NR-00 - Power Supply: 25EP0-222001-D0S - C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional extra) - C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional extra) - Ring topology kit: 6NH23NR48SR-00 (in option) |
