H252-3C0 (rev. 100)
製品種別 | サーバ |
---|---|
CPUソケット数 | 1 |
CPU | |
筐体サイズ | 2U |
最大GPU数 | |
電源仕様 | リダンダント電源 |
用途/特長 | |
製品説明 | Application: HCI & Hybrid/Private Cloud Server |
製品仕様
Dimensions (WxHxD, mm) | 2U 4 Nodes - Rear access 440 x 87.5 x 695 |
---|---|
Motherboard | MH12-HD0 |
CPU | 3rd Generation Intel® Xeon® Scalable Processors Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor 10nm technology, CPU TDP up to 270W |
Socket | Per Node: 1 x LGA 4189 Total: 4 x LGA 4189 Socket P+ |
Chipset | Intel® C621A Express Chipset |
Memory | Per node: 8 x DIMM slots Total: 32 x DIMM slots DDR4 memory supported only 8-Channel memory architecture RDIMM modules up to 64GB supported LRDIMM modules up to 128GB supported 3DS RDIMM/LRDIMM modules up to 256GB supported Memory speed: Up to 3200 MHz |
LAN | Per node: 2 x 1GbE LAN ports (1 x Intel® I350-AM2) 1 x Dedicated management port Total: 8 x 1GbE LAN ports (1 x Intel® I350-AM2) 4 x Dedicated management ports 1 x 10/100/1000 *CMC global management port *CMC: Chassis Management Controller, to monitor all status of computing nodes |
Video | Integrated in Aspeed® AST2500 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp, DDR4 SDRAM Management chip on CMC board: Integrated in Aspeed® AST2520A2-GP |
Audio | N/A |
Storage | Per node: 3 x 3.5" SATA/SAS hot-swappable SSD bays 1 x SATA DOM Total: 12 x 3.5" SATA/SAS hot-swappable SSD bays 4 x SATA DOM |
SAS | N/A |
RAID | N/A |
Peripheral Drives | N/A |
Expansion Slots | Per node: 2 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) 1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth (Type1, P1, P2 with NCSI supported) Total: 8 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) 4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth (Type1, P1, P2 with NCSI supported) |
Internal I/O | Per node: 1 x USB 3.0 header 1 x SATA DOM 1 x TPM header 1 x OCP 2.0 mezzanine slots 1 x Front panel header 1 x Back plane board header 1 x IPMB connector 1 x Clear CMOS jumper 1 x BIOS recovery jumper |
Front I/O | Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED Total: 4 x Power button with LED 4 x ID button with LED 4 x Status LED *1 x CMC status LED *Only one CMC status LED per system |
Rear I/O | Per node: 2 x USB 3.0 1 x VGA 2 x RJ45 1 x MLAN 1 x ID LED Total: 8 x USB 3.0 4 x VGA 8 x RJ45 4 x MLAN 4 x ID LEDs *1 x CMC global management port *Only one CMC global management port per system |
Backplane I/O | 12 x ports Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s per port |
TPM | 1 x TPM header with SPI interface Optional TPM2.0 kit: CTM010 |
Power Supply | 2 x 1600W redundant PSUs 80 PLUS Platinum AC Input: - 100-127V~/ 12A, 47-63Hz - 200-219V~/ 10A, 47-63Hz - 220-240V~/ 10A, 47-63Hz DC Output: - Max 1000W/ 100-127V~ +12V/ 83A +12Vsb/ 3A - Max 1800W/ 200-240V +12V/ 148A +12Vsb/ 3A - Max 1968W/ 200-240V +12V/ 162A +12Vsb/ 3A |
System Management | Aspeed® AST2500 management controller GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
|
OS Compatibility | Windows Server 2016 Windows Server 2019 Red Hat Enterprise Linux 8.3 ( x64) or later SUSE Linux Enterprise Server 12 SP5 ( x64) or later SUSE Linux Enterprise Server 15 SP2 ( x64) or later Ubuntu 18.04.5 LTS (x64) or later Ubuntu 20.04 LTS (x64) or later VMware ESXi 6.7 Update3 P03 or later VMware ESXi 7.0 Update1 or later Citrix Hypervisor 8.2.0 or later |
System Fans | 4 x 80x80x38mm (16,300rpm) |
Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8%-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) |
Packaging Dimensions | 1167 x 700 x 309 mm |
Packaging Content | 1 x H252-3C0 4 x CPU heatsinks 1 x Rail Kit |
Part Numbers | Barebone package: 6NH2523C0MR-00 Spare parts: - Motherboard: 9MZ12HD0NR-00 - Rail kit: 25HB2-AN6103-K0R - CPU heatsink: 25ST1-44320J-A0R - Back plane board: 9CBPH0O4NR-00 - Power Supply: 25EP0-220008-D0S - Ring topology kit: 6NH262Z65SR-00-100 (optional extra) |