製品情報

H262-NO0 (rev. 100)

製品種別 サーバ
CPUソケット数 2
CPU  
筐体サイズ 2U
最大GPU数
電源仕様 リダンダント電源
用途/特長   
製品説明 Application: HCI & Hybrid/Private Cloud Server

第3世代 Intel Xeon Scalable プロセッサーについて


製品仕様

Dimensions (WxHxD, mm) 2U 4 Nodes - Rear access
440 x 87 x 840
Motherboard MH62-HD1
CPU 3rd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
10nm technology, CPU TDP up to 270W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket Per Node:
2 x LGA 4189
Total:
8 x LGA 4189
Socket P+
Chipset Intel® C621A Express Chipset
Memory Per node:
16 x DIMM slots

Total:
64 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
LAN Per node:
2 x 10GbE BASE-T LAN ports (1 x Intel® X710-AT2)
1 x Dedicated management port

Total:
8 x 10GbE BASE-T LAN ports (1 x Intel® X710-AT2)
4 x Dedicated management port

* CMC: Chassis Management Controller, to monitor all status of computing nodes
Video Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Audio N/A
Storage Per node:
6 x SATA/SAS/NVMe hot-swappable bays
1 x SATA DOM

Total:
24 x SATA/SAS/NVMe hot-swappable bays
4 x SATA DOM
SAS N/A
RAID For SATA drives:
Intel® SATA RAID 0/1/5/10
For NVMe drives:
Intel® Virtual RAID On CPU (VROC) RAID 0, 1, 10, 5
Note:
1) VROC module is compatible for Intel®SSD only
2) Default 1 PCS VROC module for one 2U 4 Nodes server system
Peripheral Drives N/A
Expansion Slots Per node:
Riser Card CRSH010:
- 1 x Half-length low-profile slot with PCIe x16 (Gen4 x16 bus)

Riser Card CRSH011:
- 1 x Half-length low-profile slots with PCIe x8 (Gen4 x8 bus)

1 x OCP mezzanine slot with PCIe Gen3 x16 bus

Total:
4 x Half-length low-profile slots with PCIe x16 (Gen4 x16 bus)
4 x Half-length low-profile slots with PCIe x8 (Gen4 x8 bus)
4 x OCP mezzanine slots with PCIe Gen3 x16 bus
Internal I/O Per node:
1 x COM header
1 x SATA 7-pin connectors
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
Front I/O Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x Reset button

*1 x CMC Status LED
*1 x CMC Reset button

*Only one CMC Status LED and Reset button per system
Rear I/O Per node:
2 x USB 3.0
1 x VGA
1 x RJ45 MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
4 x RJ45 MLAN
4 x ID LEDs
*1 x CMC global management port

*Only one CMC global management port per system
Backplane I/O 24 x ports
PCIe Gen4 x4 U.2 per port
TPM 1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply 2 x 2200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V
+12.12V/ 178.1A
+12Vsb/ 3.5A

NOTE:
* The system power supply requires C19 type power cord
System Management Aspeed® AST2500 management controller
AMI MegaRAC SP-X Solution Web interface

  • Dashboard
  • JAVA Based Serial Over LAN
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 8.3 ( x64) or later

SUSE Linux Enterprise Server 12 SP5 ( x64) or later
SUSE Linux Enterprise Server 15 SP2 ( x64) or later

Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later

Citrix Hypervisor 8.2.0 or later
System Fans 8 x 80x80x38mm (16,300rpm)
Operating Properties Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions 1180 x 779 x 300 (mm)
Packaging Content 1 x H262-NO0
8 x CPU heatsinks
1 x Rail Kit
1 x VROC module
Part Numbers Barebone package: 6NH262NO0MR-00
Spare parts:
- Motherboard: 9MH62HD1NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- Back plane board: 9CBPH0O4NR-00
- Power Supply: 25EP0-222003-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional)
- Ring topology kit: 6NH262Z65SR-00-100 (optional extra)