H262-PC0 (rev. 100)
| 製品種別 | サーバ |
|---|---|
| CPUソケット数 | 2 |
| CPU | |
| 筐体サイズ | |
| 最大GPU数 | |
| 電源仕様 | リダンダント電源 |
| 用途/特長 | |
| 製品説明 |
第3世代 Intel Xeon Scalable プロセッサーについて
製品仕様
| Dimensions (WxHxD, mm) | 2U 4 Nodes - Rear access 440 x 87 x 840 |
|---|---|
| Motherboard | MH62-HD0 |
| CPU | 3rd Generation Intel® Xeon® Scalable Processors Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor 10nm technology, CPU TDP up to 270W NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable |
| Socket | Per Node: 2 x LGA 4189 Total: 8 x LGA 4189 Socket P+ |
| Chipset | Intel® C621A Express Chipset |
| Memory | Per node: 16 x DIMM slots Total: 64 x DIMM slots DDR4 memory supported only 8-channel memory architecture RDIMM modules up to 64GB supported LRDIMM modules up to 128GB supported 3DS RDIMM/LRDIMM modules up to 256GB supported 1.2V modules: 3200/2933/2666 MHz |
| LAN | Per node: 2 x 10GbE BASE-T LAN ports (1 x Intel® X710-AT2) 1 x Dedicated management port Total: 8 x 10GbE BASE-T LAN ports (1 x Intel® X710-AT2) 4 x Dedicated management port * CMC: Chassis Management Controller, to monitor all status of computing nodes |
| Video | Integrated in Aspeed® AST2500 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp, DDR4 SDRAM Management chip on CMC board: Integrated in Aspeed® AST2520A2-GP |
| Audio | N/A |
| Storage | Per node: 2 x SATA/SAS/NVMe hot-swappable bays 1 x SATA DOM Total: 8 x SATA/SAS/NVMe hot-swappable bays 4 x SATA DOM |
| SAS | N/A |
| RAID | For SATA drives: Intel® SATA RAID 0/1 For NVMe drives: Intel® Virtual RAID On CPU (VROC) RAID 0, 1 Note: 1) VROC module is compatible for Intel®SSD only 2) Default 1 PCS VROC module for one 2U 4 Nodes server system |
| Peripheral Drives | N/A |
| Expansion Slots | Per node: Riser Card CRSH010: - 1 x Half-length low-profile slot with PCIe x16 (Gen4 x16 bus) Riser Card CRSH011: - 1 x Half-length low-profile slots with PCIe x8 (Gen4 x8 bus) 1 x OCP mezzanine slot with PCIe Gen3 x16 bus Total: 4 x Half-length low-profile slots with PCIe x16 (Gen4 x16 bus) 4 x Half-length low-profile slots with PCIe x8 (Gen4 x8 bus) 4 x OCP mezzanine slots with PCIe Gen3 x16 bus |
| Internal I/O | Per node: 1 x COM header 1 x SATA 7-pin connectors 1 x TPM header 1 x BMC SGPIO header 1 x JTAG BMC header 1 x PLD header 1 x Clear CMOS jumper 1 x IPMB connector 1 x Buzzer |
| Front I/O | Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED 1 x Reset button Total: 4 x Power button with LED 4 x ID button with LED 4 x Status LED 4 x Reset button *1 x CMC Status LED *1 x CMC Reset button *Only one CMC Status LED and Reset button per system |
| Rear I/O | Per node: 2 x USB 3.0 1 x VGA 1 x RJ45 MLAN 1 x ID LED Total: 8 x USB 3.0 4 x VGA 4 x RJ45 MLAN 4 x ID LEDs *1 x CMC global management port *Only one CMC global management port per system |
| Backplane I/O | 8 x ports PCIe Gen4 x4 U.2 per port |
| TPM | 1 x TPM header with SPI interface Optional TPM2.0 kit: CTM010 |
| Power Supply | 2 x 2200W redundant PSUs
80 PLUS Platinum
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V +12.12V/ 178.1A +12Vsb/ 3.5A NOTE: * The system power supply requires C19 type power cord |
| System Management | Aspeed® AST2500 management controller AMI MegaRAC SP-X Solution Web interface
|
| OS Compatibility | Windows Server 2016 Windows Server 2019 Red Hat Enterprise Linux 7.8 ( x64) or later Red Hat Enterprise Linux 7.9 ( x64) or later Red Hat Enterprise Linux 8.2 ( x64) or later Red Hat Enterprise Linux 8.3 ( x64) or later SUSE Linux Enterprise Server 15 SP2 ( x64) or later Ubuntu 20.04 LTS (x64) or later Ubuntu 20.04.1 LTS (x64) or later VMware ESXi 7.0 Update1 or later VMware ESXi 7.0 Update2 or later |
| System Fans | 8 x 80x80x38mm (16,300rpm) |
| Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) |
| Packaging Dimensions | 1180 x 779 x 300 (mm) |
| Packaging Content | 1 x H262-PC0 8 x CPU heatsinks 1 x Rail Kit 1 x VROC module |
| Part Numbers | Barebone package: 6NH262PC0MR-00 Spare parts: - Motherboard: 9MH62HD0NR-00 - VROC module: 25FD0-R181N0-10R - Rail kit: 25HB2-AN6103-K0R - CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R - Back plane board: 9CBPH0O4NR-00 - Power Supply: 25EP0-222003-D0S - C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional) - C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional) - C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional) - Ring topology kit: 6NH262Z65SR-00-100 (optional extra) |
