製品情報

H23N-H60 (rev. 100)

製品種別 サーバ
CPUソケット数
CPU  
 
筐体サイズ
最大GPU数
電源仕様
用途/特長
製品説明

製品仕様

Dimensions (WxHxD, mm) 2U 448 x 87 x 755
Motherboard MH60-RE1
CPU Intel® Xeon® E5-2600 V3 processors Intel® Xeon® E5-2600 V4 processorsNOTE: If only 1 CPU is installed, some PCIe, memory, I/O functions might be unavailable.
Socket Per node: 2 x LGA 2011-3Total: 8 x LGA 2011-3 Mounting pitch: square ILM (80x80mm)Max. length of M4 screw threads: 3.7mmScrews longer than 3.7mm might damage the motherboard
Chipset Intel® C612
Memory Per node: 16 x DIMM slotsTotal: 64 x DIMM slotsDDR4 memory supported only Quad channel memory architecture RDIMM modules up to 32GB supported LRDIMM modules up to 64GB supported 3DS LRDIMM modules up to 128GB supported 1.2V modules: 1600/1866/2133/2400 MHz
LAN Per node: 2 x 10Gb/s SFP+ LAN ports (Mellanox® ConnectX-3 Pro) 1 x GbE LAN ports (Intel® I210-AT) 1 x 10/100/1000 management LANTotal: 8 x 10Gb/s SFP+ LAN ports (Mellanox® ConnectX-3 Pro) 4 x GbE LAN ports (Intel® I210-AT) 4 x 10/100/1000 management LAN 1 x 10/100/1000 *CMC LAN *CMC: Chassis Management Controller, to monitor all status of computing nodes.
Video Integrated in Aspeed® AST2400 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp Management chip in CMC board: Integrated in Aspeed® AST1050
Audio -
Storage Per node: 4 x 2.5" SAS/SATA hot-swappable HDD/SSD bays ( from C612) 2 x 2.5" NVMe HDD/SSD baysTotal: 24 x 2.5" hot-swappable HDD/SSD bays - 16 x SAS/SATA hot-swappable HDD/SSD bays ( from 4 x C612) - 8 x NVMe HDD/SSD bays
RAID Intel® SATA RAID 0/1/5/10
Peripheral Drives -
Expansion Slots Per node: 1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus) connector 1 x Mezzanine PCIe x8 (Gen3 x8 bus) connectorTotal: 4 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) connectors 4 x Mezzanine PCIe x8 (Gen3 x8 bus) connectors
Internal I/O Per node: 1 x COM header 1 x TPM header 1 x BMC SGPIO header 1 x JTAG BMC header 1 x PLD header 1 x PMBUS header 1 x PMBUS selection jumper 1 x BMC FRB jumper 1 x Clear CMOS jumper 1 x Power on selection jumper 1 x ACK selection jumper 1 x IPMB connector
Front I/O Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LEDTotal: 4 x Power button with LED 4 x ID button with LED 4 x Status LED *1 x CMC status LED *Only one CMC status LED per system
Rear I/O Per node: 2 x USB 3.0 1 x VGA 2 x SFP+ 1 x RJ45 1 x RJ45 MLAN 1 x ID button with LEDTotal: 8 x USB 3.0 4 x VGA 8 x SFP+ 4 x RJ45 4 x RJ45 MLAN 4 x ID button with LED *1 x CMC MLAN *Only one CMC MLAN per system
Backplane I/O - 16 x SAS/SATA ports 12Gb/s & 6Gb/s compatible - 8 x NVMe ports for NVMe devices only
TPM 1 x TPM header
Power Supply 2 x 2000W redundant PSU 80 PLUS Platinum AC input: - 1000W: 100-127V/ 12-9.5A, 50-60Hz - 1800W: 200-220V/ 10-9.5A, 50-60Hz - 1980W: 220-230V/ 10-9.8A, 50-60Hz - 2000W: 230-240V/ 10-9.8A, 50-60Hz DC output: Max 1000W@100-127V: +12V/ 83.3A +12Vsb/ 2.1A 1800W@200-220V +12V/ 150.0A +12Vsb/ 2.1A 1980W@220-230V +12V/ 165.0A +12Vsb/ 2.1A 2000W@200-240V +12V/ 166.7A +12Vsb/ 2.1A
System Management Aspeed® AST2400 management controller Avocent® MergePoint IPMI 2.0 web interface:Cold Redundancy Intelligent Power Management (IPM) Network settings Network security settings Users control Services settings IPMI settings Sessions control LDAP settings Power control Voltages, fans and temperatures monitoring System event log Events management (platform events, trap settings, email settings) Serial Over LAN vKVM & vMedia (launch, configuration)
OS Supported Windows Server 2008 R2 (x64) Windows Server 2012 (x64) Windows Server 2012 R2 (x64) Red Hat Enterprise Linux 6.7 (x86/x64) Red Hat Enterprise Linux 7.2 (x64) SUSE Linux Enterprise Server 11.4 (x86/x64) SUSE Linux Enterprise Server 12 (x64) Ubuntu 12.04 LTS (x86/x64) Ubuntu 14.04 LTS (x86/x64) VMware ESXi 5.1 U2 VMware ESXi 5.5 U2 VMware ESXi 6.0 U1
Weight 25 kg (full packaging)
System Fans 4 x 80x80x38mm (16’300rpm)
Operating Properties Operating temperature: 5°C to 35°C ŠNon-operating temperature: 0°C to 40°C Š10-80% operating humidity at 30°C
Part Numbers - Barebone: 6NH23NH60MR-00 - Power Supply: 25EP0-220003-C2S - Tool-less rail kit: 25HB2-AN6805-K0R
Packaging Dimensions 981 X 585 X 314 mm
Packaging Content 1 x H23N-H60 8 x CPU heatsinks 1 x Quick start guide 1 x Rail Kit