製品情報

H270-H70 (rev. 100)

製品種別 サーバ
CPUソケット数
CPU  
 
筐体サイズ
最大GPU数
電源仕様
用途/特長
製品説明

製品仕様

Dimensions (WxHxD, mm) 2U
447 x 87.2 x 780
Motherboard MH70-HD1
CPU Intel® Xeon® E5-2600 V3 processors
Intel® Xeon® E5-2600 V4 processors
NOTE: If only 1 CPU is installed, some PCIe, memory, network or I/O functions might be unavailable.
Socket Per node:
2 x LGA 2011-3
Total:
8 x LGA 2011-3
Mounting pitch: narrow ILM (56x94mm)
Max. length of M4 screw threads: 3.7mm
Screws longer than 3.7mm might damage the motherboard
Chipset Intel® C612
Memory Per node:
16 x DIMM slots

Total:
64 x DIMM slots
DDR4 memory supported only
Quad channel memory architecture
RDIMM modules up to 32GB supported
LRDIMM modules up to 64GB supported
3DS LRDIMM modules up to 128GB supported
1.2V modules: 1600/1866/2133/2400 MHz
LAN Per node:
2 x GbE LAN ports (Intel® I350-AM2)
1 x 10/100/1000 management LAN

Total:
8 x GbE LAN ports (Intel® I350-AM2)
4 x 10/100/1000 management LAN
Video Integrated in Aspeed® AST2400
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Audio -
Storage Per node:
4 x 2.5" hot-swappable HDD/SSD bays

Total:
16 x 2.5" hot-swappable HDD/SSD bays
SATA Per node:
6 x SATA III 6Gb/s ports

Total:
24 x SATA III 6Gb/s ports
SAS -
RAID Intel® SATA RAID 0/1/5/10
Peripheral Drives -
Expansion Slots Per node:
1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus) connector
1 x Mezzanine PCIe x8 (Gen3 x8 bus) connector

Total:
4 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) connectors
4 x Mezzanine PCIe x8 (Gen3 x8 bus) connectors
Internal I/O Per node:
2 x 18-pin power connectors
1 x Mini-SAS connector
6 x SATA III 6Gb/s ports
1 x USB 3.0 header
1 x Serial header
1 x VGA header
1 x TPM header
1 x Front panel header
1 x SATA power header
1 x SATA SGPIO header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x PMBUS header
1 x PMBUS selection jumper
1 x BMC FRB jumper
1 x Software RAID jumper
1 x Clear CMOS jumper
1 x Power on selection jumper
1 x ACK selection jumper
1 x IPMB connector
Front I/O Per node:
2 x USB 3.0
1 x VGA
1 x Power button with LED
1 x ID button with LED

Total:
8 x USB 3.0
4 x VGA
4 x Power buttons with LED
4 x ID buttons with LED
Rear I/O Per node:
2 x USB 3.0
1 x VGA
1 x Serial
3 x RJ45
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x System status LED
2 x LAN activity LEDs

Total:
8 x USB 3.0
4 x VGA
4 x Serial
12 x RJ45
4 x Power buttons with LED
4 x ID buttons with LED
4 x NMI buttons
4 x Reset buttons
4 x System status LEDs
8 x LAN activity LEDs
Backplane I/O 4 x SAS/SATA ports
TPM 1 x TPM header
Power Supply 2 x 1600W redundant PSU
80 PLUS Platinum

AC input:
- 100-127V/ 12A, 47-63Hz
- 200-240V/ 9.48A, 47-63Hz

DC output:
- 1000W@100-127V
- 1600W@200-240V
System Management Aspeed® AST2400 management controller
Avocent® MergePoint IPMI 2.0 web interface:
  • Network settings
  • Network security settings
  • Users control
  • Services settings
  • IPMI settings
  • Sessions control
  • LDAP settings
  • Power control
  • Voltages, fans and temperatures monitoring
  • System event log
  • Events management (platform events, trap settings, email settings)
  • Serial Over LAN
  • vKVM & vMedia (launch, configuration)
OS Compatibility Windows Server 2008 R2 (x64)
Windows Server 2012 (x64)
Windows Server 2012 R2 (x64)
Windows Server 2016

Red Hat Enterprise Linux 6.7 (x86/x64)
Red Hat Enterprise Linux 7.2 (x64)

SUSE Linux Enterprise Server 11.4 (x86/x64)
SUSE Linux Enterprise Server 12 (x64)

Ubuntu 12.04 LTS (x86/x64)
Ubuntu 14.04 LTS (x86/x64)

VMware ESXi 5.1 U2
VMware ESXi 5.5 U2
VMware ESXi 6.0 U1
Weight 38kg
System Fans 16 x 40x40x56mm (23’000rpm)
Operating Properties Operating temperature: 5°C to 35°C
ŠNon-operating temperature: 0°C to 40°C
Š10-80% operating humidity at 30°C
Packaging Dimensions 1133x724x261mm
Packaging Content 1 x Driver CD
8 x CPU heatsinks
1 x User manual
1 x Rail Kit
Part Numbers - Barebone: 6NH270H70MR-00
- Power Supply: 25EP0-216003-D0S
- Tool-less rail kit: 25HB2-A86100-K0R