製品情報

S451-Z30 (rev. 200)

製品種別 サーバ
CPUソケット数
CPU  
筐体サイズ 4U
最大GPU数
電源仕様 リダンダント電源
用途/特長  
製品説明

製品仕様

Dimensions (WxHxD, mm) 4U
482.6 x 177 x 625
Motherboard MZ31-AR0
CPU AMD EPYC™ 7001 series processor family
Single processor, 14nm
Up to 32-core, 64 threads
TDP up to 155W
Socket Socket SP3
Chipset System on Chip
Memory 16 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Memory speed: 2666(1DPC)/2400/2133* MHz

- Note:
Memory speed run at 2133MHz when 1R/2R memory modules are fully populated
LAN 2 x SFP+ 10Gb/s LAN ports (Broadcom® BCM 57810S)
1 x 10/100/1000 management LAN
Video Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Audio -
Storage Front side: 24 x 3.5" or 2.5" SATA/SAS hot-swappable HDD/SSD bays
Rear side: 12 x 3.5" or 2.5" SATA/SAS hot-swappable HDD/SSD bays
Rear side booting device bay: 2 x 2.5" hot-swappable SSD bays*

NOTE:
* For rear side 2.5" bays support Solid State Drives only due to thermal consideration

2 x Broadcom SAS3x36R expanders
Bandwidth: SATAIII 6Gb/s or SAS 12Gb/s per port
Default configuration supports:
2 x SAS/SATA drives in rear side
SAS card is required to enable the drive bays

Suggested 12Gb/s SAS cards:
CRA4648
CSA4648
SATA -
SAS Depends on SAS add-on Card
RAID Depends on SAS add-on Card
Peripheral Drives -
Expansion Slots Slot_7: 1 x PCIe x8 (Gen3 x8 bus) slot
Slot_6: 1 x PCIe x16 (Gen3 x16 bus) slot
Slot_5: 1 x PCIe x16 (Gen3 x8 bus) slot
Slot_4: 1 x PCIe x16 (Gen3 x16 bus) slot
Slot_3: 1 x PCIe x16 (Gen3 x16 bus) slot
Slot_2: 1 x PCIe x8 (Gen3 x8 bus) slot
Slot_1: 1 x PCIe x16 (Gen3 x16 bus) slot

1 x M.2 slot:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280 cards
Internal I/O 1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
4 x SlimSAS connectors
1 x M.2 slot
2 x CPU fan headers
5 x System fan headers
1 x USB 3.0 header
1 x USB 2.0 header
1 x COM_2 header
1 x TPM header
1 x Front panel header
2 x LAN activity LED
1 x HDD back plane board header
1 x PMBus connector
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
1 x Buzzer
Front I/O 2 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x System status LED
2 x LAN activity LEDs
Rear I/O 2 x USB 3.0
1 x VGA
2 x SFP+
2 x RJ45
1 x MLAN
1 x ID button with LED
2 x LAN activity LEDs
Backplane I/O Bandwidth: SATAIII 6Gb/s or SAS 12Gb/s per port
TPM 1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
Power Supply 2 x 1200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-240V~/ 12-7A, 50-60Hz
DC Input:
- 240Vdc/ 6A

DC Output:
- Max 1000W/ 100-240V~
+12V/ 80.5A
+12Vsb/ 3A
- Max 1200W/ 200-240V~ or 240Vdc input
+12V/ 97A
+12Vsb/ 3A
System Management Aspeed® AST2500 management controller
Avocent® MergePoint IPMI 2.0 web interface:

  • Network settings
  • Network security settings
  • Hardware information
  • Users control
  • Services settings
  • IPMI settings
  • Sessions control
  • LDAP settings
  • Power control
  • Fan profiles
  • Voltages, fans and temperatures monitoring
  • System event log
  • Events management (platform events, trap settings, email settings)
  • Serial Over LAN
  • vKVM & vMedia (HTML5)
OS Compatibility Windows Server 2012 R2 with Update
Windows Server 2016

Red Hat Enterprise Linux 7.4 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later

SUSE Linux Enterprise Server 11.4 (x64) or later
SUSE Linux Enterprise Server 12.3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 16.04 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later

VMware ESXi 6.5 Update1 or later
VMware ESXi 6.7 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0
Weight 53 kg
System Fans 7 x 80x80x38mm (9000rpm)
Operating Properties Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions 843 x 610 x 290 mm
Packaging Content 1 x S451-Z30
1 x CPU heatsinks
1 x Rail kit
Part Numbers Barebone package: 6NS451Z30MR-00-2*
Part Numbers:
- Motherboard: 9MZ31AR0NR-00-1*
- Rail kit: 25HB2-3A6103-I0R
- CPU heatsink: 25ST1-15320E-J1R
- Back plane board_Front_24-port: 25FBZ-RS4240-I1R
- Back plane board_Rear_12-port: 25FBZ-RS2121-I1R
- Back plane board_Rear_2*2.5"-port: 25FBZ-RA1020-I1R
- 1200W Power supply: 25EP0-212002-F3S