![](/admin/imgs/gigabyte/H261-3C0-rev-100.png?1.7046004541135")
H261-3C0 (rev. 100)
| 製品種別 | サーバ |
|---|---|
| CPUソケット数 | |
| CPU | |
| 筐体サイズ | 2U |
| 最大GPU数 | |
| 電源仕様 | リダンダント電源 |
| 用途/特長 | |
| 製品説明 |
製品仕様
| Dimensions (WxHxD, mm) | 2U 4 Nodes - Rear access 440 x 87 x 820 |
|---|---|
| Motherboard | MH61-HD3 |
| CPU | 2nd Generation Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor CPU TDP up to 165W NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable |
| Socket | Per Node: 2 x LGA 3647 Total: 8 x LGA 3647 Socket P |
| Chipset | Intel® C621 Express Chipset |
| Memory | Per node: 16 x DIMM slots Total: 64 x DIMM slots DDR4 memory supported only 6-channel memory architecture RDIMM modules up to 64GB supported LRDIMM modules up to 128GB supported Supports Intel® Optane™ DC Persistent Memory (DCPMM) 1.2V modules: 2933( 1DPC)/2666/2400/2133 MHz Maximum verified DCPMM configuration: * Ambient temperature 35°C * 2nd Generation Intel® Xeon® Scalable processor 165W (Max.) * DCPMM 256GB x2 pcs (Per Node) DCPMM installation locations: DIMM_P1_( G1, J1) NOTE: 1. 2933MHz for 2nd Generation Intel® Xeon® Scalable Processors only 2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only 3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C 4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative |
| LAN | Per node: 2 x 10Gb/s BASE-T LAN ports (Intel® X550-AT2) 1 x Dedicated management port Total: 8 x 10Gb/s BASE-T LAN ports (Intel® X550-AT2) 4 x Dedicated management ports 1 x 10/100/1000 *CMC global management port *CMC: Chassis Management Controller, to monitor all status of computing nodes Omni-Path is supported in option |
| Video | Integrated in Aspeed® AST2500 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp, DDR4 SDRAM Management chip in CMC board: Integrated in Aspeed® AST1250 |
| Audio | - |
| Storage | Per node: 3 x 3.5" SATA/SAS hot-swappable HDD/SSD bays Onboard SATA DOM support (PIN_7, PIN_8 or external cable) Total: 12 x 3.5" SATA/SAS hot-swappable HDD/SSD bays 2.5" HDD/SSD supported SAS card is required for SAS devices support |
| RAID | Intel® SATA RAID 0/1/5 |
| Peripheral Drives | - |
| Expansion Slots | Per node: 1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus) 1 x Half-length low-profile slot with PCIe x8 (Gen3 x8 bus) 1 x OCP mezzanine slot with PCIe Gen3 x16 bus Total: 4 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus) 4 x Half-length low-profile slot with PCIe x8 (Gen3 x8 bus) 4 x OCP mezzanine slot with PCIe Gen3 x16 bus |
| Internal I/O | Per node: 1 x COM header 1 x TPM header 1 x BMC SGPIO header 1 x JTAG BMC header 1 x PLD header 1 x Clear CMOS jumper 1 x IPMB connector 1 x Buzzer |
| Front I/O | Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED Total: 4 x Power button with LED 4 x ID button with LED 4 x Status LED *1 x CMC status LED *Only one CMC status LED per system |
| Rear I/O | Per node: 2 x USB 3.0 1 x VGA 2 x RJ45 1 x RJ45 MLAN 1 x ID LED Total: 8 x USB 3.0 4 x VGA 8 x RJ45 4 x RJ45 MLAN 4 x ID LEDs *1 x CMC global management port *Only one CMC global management port per system |
| Backplane I/O | 12 x ports 12Gb/s & 6Gb/s compatible |
| TPM | 1 x TPM header with LPC interface Optional TPM2.0 kit: CTM000 |
| Power Supply | 2 x 2200W redundant PSUs
80 PLUS Platinum
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V +12.12V/ 178.1A +12Vsb/ 3.5A NOTE: * The system power supply requires C19 type power cord * 2000W 80 PLUS Titanium PSU as an option |
| System Management | Aspeed® AST2500 management controller Avocent® MergePoint IPMI 2.0 web interface:
|
| OS Compatibility | For Skylake processors: Windows Server 2012 R2 with Update Windows Server 2016 Windows Server 2019 Red Hat Enterprise Linux 6.9 (x64) or later Red Hat Enterprise Linux 7.3 (x64) or later Red Hat Enterprise Linux 8.0 (x64) or later SUSE Linux Enterprise Server 11.4 (x64) or later SUSE Linux Enterprise Server 12.2 (x64) or later SUSE Linux Enterprise Server 15 (x64) or later Ubuntu 16.04.1 LTS (x64) or later Ubuntu 18.04 LTS (x64) or later VMware ESXi 6.0 Update3 or later VMware ESXi 6.5 or later VMware ESXi 6.7 or later Citrix Xenserver 7.1.0 CU2 or later Citrix Xenserver 7.4.0 or later Citrix Hypervisor 8.0.0 For Cascade Lake processors: Windows Server 2012 R2 with Update Windows Server 2016 Windows Server 2019 Red Hat Enterprise Linux 7.6 (x64) or later Red Hat Enterprise Linux 8.0 (x64) or later SUSE Linux Enterprise Server 12.3 (x64) or later SUSE Linux Enterprise Server 15 (x64) or later Ubuntu 18.04 LTS (x64) or later VMware ESXi 6.0 Update3 or later VMware ESXi 6.5 Update2 or later VMware ESXi 6.7 Update1 or later Citrix Xenserver 7.1.0 CU2 or later Citrix Xenserver 7.5.0 or later Citrix Hypervisor 8.0.0 |
| Weight | 35 kg (full packaging) |
| System Fans | 4 x 80x80x38mm (16,300rpm) |
| Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) |
| Packaging Dimensions | 1167 X 700 X 309 mm |
| Packaging Content | 1 x H261-3C0 8 x CPU heatsinks 1 x Rail Kit 8 x Non-Fabric CPU carrier |
| Part Numbers | Barebone package: 6NH2613C0MR-00 Spare parts: - Motherboard: 9MH61HD3NR-00 - Rail kit: 25HB2-NJ2102-N1R - CPU heatsink: 25ST1-253203-F2R/25ST1-253204-F2R - Back plane board: 9CBPH0C1NR-00 - Power Supply: 25EP0-222001-D0S - C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (in option) - C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (in option) - C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (in option) - Ring topology kit: 6NH23NR48SR-00 (in option) |
