H261-Z60 (rev. 100)
製品種別 | サーバ |
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CPUソケット数 | |
CPU | |
筐体サイズ | 2U |
最大GPU数 | |
電源仕様 | リダンダント電源 |
用途/特長 | |
製品説明 |
製品仕様
Dimensions (WxHxD, mm) | 2U 4 Nodes - Rear access 440 x 87 x 820 |
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Motherboard | MZ61-HD0 |
CPU | AMD EPYC™ 7001 series processor family Dual processors, 14nm Up to 32-core, 64 threads per processor TDP up to 200W NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable |
Socket | Per Node: 2 x LGA 4094 Total: 8 x LGA 4094 Socket SP3 |
Chipset | System on Chip |
Memory | Per node: 16 x DIMM slots Total: 64 x DIMM slots DDR4 memory supported only 8-Channel memory architecture RDIMM modules up to 64GB supported LRDIMM modules up to 128GB supported Memory speed: 2666/2400/2133 MHz |
LAN | Per node: 2 x 1GbE LAN ports (1 x Intel® I350-AM2) 1 x Dedicated management port Total: 8 x 1GbE LAN ports (1 x Intel® I350-AM2) 4 x Dedicated management ports 1 x 10/100/1000 *CMC global management port *CMC: Chassis Management Controller, to monitor all status of computing nodes |
Video | Integrated in Aspeed® AST2500 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp, DDR4 SDRAM Management chip on CMC board: Integrated in Aspeed® AST1250 |
Audio | - |
Storage | Per node: 6 x 2.5" SAS/SATA hot-swappable HDD/SSD bays Total: 24 x 2.5" hot-swappable HDD/SSD bays SAS card is required for SAS devices support |
RAID | Depends on RAID card (in option) |
Peripheral Drives | - |
Expansion Slots | Per node: 2 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) from CPU_0 1 x OCP mezzanine slot with PCIe Gen3 x16 bus from CPU_0 2 x M.2 slots from CPU_0 and CPU_1: - M-key - PCIe Gen3 x4 - Supports NGFF-2242/2260/2280/22110 cards Total: 8 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) from CPU_0 4 x OCP mezzanine slots with PCIe Gen3 x16 bus from CPU_0 8 x M.2 slots from CPU_0 and CPU_1: - M-key - PCIe Gen3 x4 - Supports NGFF-2242/2260/2280/22110 cards |
Internal I/O | Per node: 2 x M.2 slots 1 x COM header 1 x TPM header 1 x BMC SGPIO header 1 x JTAG BMC header 1 x PLD header 1 x Clear CMOS jumper 1 x IPMB connector |
Front I/O | Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED Total: 4 x Power button with LED 4 x ID button with LED 4 x Status LED *1 x CMC status LED *Only one CMC status LED per system |
Rear I/O | Per node: 2 x USB 3.0 1 x VGA 2 x RJ45 1 x RJ45 MLAN 1 x ID LED Total: 8 x USB 3.0 4 x VGA 8 x RJ45 4 x RJ45 MLAN 4 x ID LEDs *1 x CMC global management port *Only one CMC global management port per system |
Backplane I/O | 24 x ports 12Gb/s & 6Gb/s compatible |
TPM | 1 x TPM header with LPC interface Optional TPM2.0 kit: CTM000 |
Power Supply | 2 x 2200W redundant PSUs
80 PLUS Platinum
AC Input: - 100-127V~/ 14A, 47-63Hz - 200-240V~/ 12.6A, 47-63Hz DC Output: - Max 1200W/ 100-127V~ +12.12V/ 95.6A +12Vsb/ 3.5A - Max 2200W/ 200-240V +12.12V/ 178.1A +12Vsb/ 3.5A NOTE: * The system power supply requires C19 type power cord * 2000W 80 PLUS Titanium PSU as an option |
System Management | Aspeed® AST2500 management controller GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
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OS Compatibility | Windows Server 2012 R2 with Update Windows Server 2016 Red Hat Enterprise Linux 7.4 (x64) or later Red Hat Enterprise Linux 8.0 (x64) or later SUSE Linux Enterprise Server 11.4 (x64) or later SUSE Linux Enterprise Server 12.3 (x64) or later SUSE Linux Enterprise Server 15 (x64) or later Ubuntu 16.04 LTS (x64) or later Ubuntu 18.04 LTS (x64) or later VMware ESXi 6.5 Update1 or later VMware ESXi 6.7 or later Citrix Xenserver 7.1.0 CU2 or later Citrix Xenserver 7.4.0 or later Citrix Hypervisor 8.0.0 |
Weight | 35 kg (full packaging) |
System Fans | 8 x 80x80x38mm (16,300rpm) |
Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) |
Packaging Dimensions | 1167 X 700 X 309 mm |
Packaging Content | 1 x H261-Z60 8 x CPU heatsinks 1 x Rail Kit |
Part Numbers | Barebone package: 6NH261Z60MR-00-1* Spare parts: - Motherboard: 9MZ61HD0NR-00-1* - Rail kit: 25HB2-NJ2102-N1R - CPU heatsink: 25ST1-44320K-A0R/25ST1-44320L-A0R - Back plane board: 9CBPH0O0NR-00 - Power Supply: 25EP0-222001-D0S - C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional extra) - C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional extra) - C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional extra) - Ring topology kit: 6NH23NR48SR-00 (in option) |