H262-Z62 (rev. 100)
製品種別 | サーバ |
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CPUソケット数 | |
CPU | |
筐体サイズ | 2U |
最大GPU数 | |
電源仕様 | リダンダント電源 |
用途/特長 | |
製品説明 |
製品仕様
Dimensions (WxHxD, mm) | 2U 4 Nodes - Rear access 440 x 87.5 x 840 |
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Motherboard | MZ62-HD0 |
CPU | AMD EPYC™ 7002 series processor family Dual processors, 7nm technology Up to 64-core, 128 threads per processor TDP up to 200W NOTE: 1) If only 1 CPU is installed, some PCIe or memory functions might be unavailable 2) Contact GIGABYTE sales rep or technical support for more details about supporting cTDP 240W CPU Compatible with AMD EPYC™ 7001 series processor family |
Socket | Per Node: 2 x LGA 4094 Total: 8 x LGA 4094 Socket SP3 |
Chipset | System on Chip |
Memory | Per node: 16 x DIMM slots Total: 64 x DIMM slots DDR4 memory supported only 8-Channel memory per processor architecture RDIMM modules up to 64GB supported LRDIMM modules up to 128GB supported Memory speed: Up to 3200 MHz |
LAN | Per node: 2 x 1GbE LAN ports (1 x Intel® I350-AM2) 1 x Dedicated management port Total: 8 x 1GbE LAN ports (1 x Intel® I350-AM2) 4 x Dedicated management ports 1 x 10/100/1000 *CMC global management port *CMC: Chassis Management Controller, to monitor all status of computing nodes |
Video | Integrated in Aspeed® AST2500 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp, DDR4 SDRAM Management chip on CMC board: Integrated in Aspeed® AST2520A2-GP |
Audio | - |
Storage | Per node: 6 x 2.5" NVMe hot-swappable SSD bays Total: 24 x 2.5" NVMe hot-swappable SSD bays All storage bays are compatible with SATA devices |
RAID | - |
Peripheral Drives | - |
Expansion Slots | Per node: 2 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) from CPU_0 1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported) 2 x M.2 slots from CPU_0 and CPU_1: - M-key - PCIe Gen3 x4 - Supports NGFF-2242/2260/2280/22110 cards Total: 8 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) from CPU_0 4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported) 8 x M.2 slots from CPU_0 and CPU_1: - M-key - PCIe Gen3 x4 - Supports NGFF-2242/2260/2280/22110 cards |
Internal I/O | Per node: 2 x M.2 slots 1 x COM header 1 x TPM header 1 x BMC SGPIO header 1 x JTAG BMC header 1 x PLD header 1 x Clear CMOS jumper 1 x IPMB connector |
Front I/O | Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED Total: 4 x Power button with LED 4 x ID button with LED 4 x Status LED *1 x CMC status LED *Only one CMC status LED per system |
Rear I/O | Per node: 2 x USB 3.0 1 x VGA 2 x RJ45 1 x RJ45 MLAN Total: 8 x USB 3.0 4 x VGA 8 x RJ45 4 x RJ45 MLAN *1 x CMC global management port *Only one CMC global management port per system |
Backplane I/O | 24 x ports Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s or PCIe Gen3 x4 per port |
TPM | 1 x TPM header with SPI interface Optional TPM2.0 kit: CTM010 |
Power Supply | 2 x 2200W redundant PSUs
80 PLUS Platinum
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V +12.12V/ 178.1A +12Vsb/ 3.5A System power supply requires C19 type power cord |
System Management | Aspeed® AST2500 management controller GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
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OS Compatibility | Windows Server 2016 ( X2APIC/256T not supported) Windows Server 2019 Red Hat Enterprise Linux 7.6 ( x64) or later Red Hat Enterprise Linux 8.0 ( x64) or later SUSE Linux Enterprise Server 12 SP4 ( x64) or later SUSE Linux Enterprise Server 15 SP1 ( x64) or later Ubuntu 16.04.6 LTS (x64) or later Ubuntu 18.04.3 LTS (x64) or later VMware ESXi 6.5 EP15 or later VMware ESXi 6.7 Update3 or later |
Weight | Net Weight: 28 kg Gross Weight: 50 kg |
System Fans | 8 x 80x80x38mm (16,300rpm) |
Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) |
Packaging Dimensions | 1180 X 779 X 300 mm |
Packaging Content | 1 x H262-Z62 8 x CPU heatsinks 1 x Rail Kit |
Part Numbers | Barebone package: 6NH262Z62MR-00 Spare parts: - Motherboard: 9MZ62HD0NR-00 - Rail kit: 25HB2-AN6103-K0R - CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R - Back plane board: 9CBPH0O4NR-00 - Power Supply: 25EP0-222003-D0S - C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional extra) - C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional extra) - C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional extra) - Ring topology kit: 6NH262Z65SR-00-100 (optional extra) |