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H262-Z61 (rev. 100)

製品種別 サーバ
CPUソケット数
CPU 　
筐体サイズ 2U
最大GPU数
電源仕様 リダンダント電源
用途/特長 　
製品説明

製品仕様

Dimensions (WxHxD, mm) 2U 4 Nodes - Rear access
440 x 87.5 x 840
Motherboard MZ62-HD0
CPU AMD EPYC™ 7002 series processor family
Dual processors, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 200W

NOTE:
1) If only 1 CPU is installed, some PCIe or memory functions might be unavailable
2) Contact GIGABYTE sales rep or technical support for more details about supporting cTDP 240W CPU

Compatible with AMD EPYC™ 7001 series processor family
Socket Per Node:
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
Chipset System on Chip
Memory Per node:
16 x DIMM slots

Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory per processor architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Memory speed: Up to 3200 MHz
LAN Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port

Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port

*CMC: Chassis Management Controller, to monitor all status of computing nodes
Video Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Audio -
Storage Per node:
6 x 2.5" SAS/SATA hot-swappable HDD/SSD bays

Total:
24 x 2.5" hot-swappable HDD/SSD bays

SAS card is required for SAS devices support
RAID -
Peripheral Drives -
Expansion Slots Per node:
2 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) from CPU_0
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)

2 x M.2 slots from CPU_0 and CPU_1:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards

Total:
8 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) from CPU_0
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)

8 x M.2 slots from CPU_0 and CPU_1:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
Internal I/O Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
*1 x CMC status LED

*Only one CMC status LED per system
Rear I/O Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x RJ45 MLAN

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x RJ45 MLAN
*1 x CMC global management port

*Only one CMC global management port per system
Backplane I/O 24 x ports
Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s per port
TPM 1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply 2 x 2200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V
+12.12V/ 178.1A
+12Vsb/ 3.5A

System power supply requires C19 type power cord
System Management Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • JAVA Based Serial Over LAN
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility Windows Server 2016 ( X2APIC/256T not supported)
Windows Server 2019

Red Hat Enterprise Linux 7.6 ( x64) or later
Red Hat Enterprise Linux 8.0 ( x64) or later

SUSE Linux Enterprise Server 12 SP4 ( x64) or later
SUSE Linux Enterprise Server 15 SP1 ( x64) or later

Ubuntu 16.04.6 LTS (x64) or later
Ubuntu 18.04.3 LTS (x64) or later

VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
Weight Net Weight: 28 kg Gross Weight: 50 kg
System Fans 8 x 80x80x38mm (16,300rpm)
Operating Properties Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions 1180 X 779 X 300 mm
Packaging Content 1 x H262-Z61
8 x CPU heatsinks
1 x Rail Kit
Part Numbers Barebone package: 6NH262Z61MR-00
Spare parts:
- Motherboard: 9MZ62HD0NR-00
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Back plane board: 9CBPH0O4NR-00
- Power Supply: 25EP0-222003-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional extra)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional extra)
- C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional extra)
- Ring topology kit: 6NH262Z65SR-00-100 (optional extra)
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