H252-Z10 (rev. 100)
製品種別 | サーバ |
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CPUソケット数 | |
CPU | |
筐体サイズ | 2U |
最大GPU数 | |
電源仕様 | リダンダント電源 |
用途/特長 | |
製品説明 |
製品仕様
Dimensions (WxHxD, mm) | 2U 4 Nodes - Rear access 440 x 87.5 x 650 |
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Motherboard | MZ12-HD0 |
CPU | AMD EPYC™ 7002 series processor family Single processor, 7nm technology Up to 64-core, 128 threads per processor TDP up to 225W, cTDP up to 240W Compatible with AMD EPYC™ 7001 series processor family |
Socket | Per Node: 1 x LGA 4094 Total: 4 x LGA 4094 Socket SP3 |
Chipset | System on Chip |
Memory | Per node: 8 x DIMM slots Total: 32 x DIMM slots DDR4 memory supported only 8-Channel memory architecture RDIMM modules up to 64GB supported LRDIMM modules up to 128GB supported Memory speed: Up to 3200 MHz |
LAN | Per node: 2 x 1GbE LAN ports (1 x Intel® I350-AM2) 1 x Dedicated management port Total: 8 x 1GbE LAN ports (1 x Intel® I350-AM2) 4 x Dedicated management ports 1 x 10/100/1000 *CMC global management port *CMC: Chassis Management Controller, to monitor all status of computing nodes |
Video | Integrated in Aspeed® AST2500 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp, DDR4 SDRAM Management chip on CMC board: Integrated in Aspeed® AST2520A2-GP |
Audio | - |
Storage | Per node: 6 x 2.5" NVMe hot-swappable SSD bays Total: 24 x 2.5" NVMe hot-swappable SSD bays All storage bays are compatible with SATA devices |
RAID | - |
Peripheral Drives | - |
Expansion Slots | Per node: 1 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) 1 x Low profile half-length slots with PCIe x16 (Gen3 x16 bus) 1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported) 2 x M.2 slots: - M-key - PCIe Gen3 x4 - Supports NGFF-2242/2260/2280/22110 cards Total: 4 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) 4 x Low profile half-length slots with PCIe x16 (Gen3 x16 bus) 4 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported) 8 x M.2 slots: - M-key - PCIe Gen3 x4 - Supports NGFF-2242/2260/2280/22110 cards |
Internal I/O | Per node: 2 x M.2 slot 1 x USB 3.0 header 1 x TPM header 1 x OCP 2.0 mezzanine slots 1 x Front panel header 1 x Back plane board header 1 x IPMB connector 1 x Clear CMOS jumper 1 x BIOS recovery jumper |
Front I/O | Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED Total: 4 x Power button with LED 4 x ID button with LED 4 x Status LED *1 x CMC status LED *Only one CMC status LED per system |
Rear I/O | Per node: 2 x USB 3.0 1 x VGA 2 x RJ45 1 x MLAN 1 x ID LED Total: 8 x USB 3.0 4 x VGA 8 x RJ45 4 x MLAN 4 x ID LEDs *1 x CMC global management port *Only one CMC global management port per system |
Backplane I/O | 24 x ports Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s or PCIe Gen3 x4 per port |
TPM | 1 x TPM header with SPI interface Optional TPM2.0 kit: CTM010 |
Power Supply | 2 x 2000W redundant PSUs 80 PLUS Platinum AC Input: - 100-127V~/ 12A, 47-63Hz - 200-219V~/ 10A, 47-63Hz - 220-240V~/ 10A, 47-63Hz DC Output: - Max 1000W/ 100-127V~ +12V/ 83A +12Vsb/ 3A - Max 1800W/ 200-240V +12V/ 148A +12Vsb/ 3A - Max 1968W/ 200-240V +12V/ 162A +12Vsb/ 3A System power supply requires C19 type power cord |
System Management | Aspeed® AST2500 management controller GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
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OS Compatibility | Windows Server 2016 ( X2APIC/256T not supported) Windows Server 2019 Red Hat Enterprise Linux 7.6 ( x64) or later Red Hat Enterprise Linux 8.0 ( x64) or later SUSE Linux Enterprise Server 12 SP4 ( x64) or later SUSE Linux Enterprise Server 15 SP1 ( x64) or later Ubuntu 16.04.6 LTS (x64) or later Ubuntu 18.04.3 LTS (x64) or later VMware ESXi 6.5 EP15 or later VMware ESXi 6.7 Update3 or later |
Weight | Net Weight: 27.3 kg Gross Weight: 45.92 kg |
System Fans | 8 x 80x80x38mm (16,300rpm) |
Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) |
Packaging Dimensions | 1167 x 700 x 309 mm |
Packaging Content | 1 x H252-Z10 4 x CPU heatsinks 1 x Rail Kit |
Part Numbers | Barebone package: 6NH252Z10MR-00 Spare parts: - Motherboard: 9MZ12HD0NR-00 - Rail kit: 25HB2-AN6103-K0R - CPU heatsink: 25ST1-44320J-A0R - Back plane board: 9CBPH0O4NR-00 - Power Supply: 25EP0-220008-D0S - C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional extra) - C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional extra) - C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional extra) - Ring topology kit: 6NH262Z65SR-00-100 (optional extra) |