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H242-Z11 (rev. 100)

製品種別 サーバ
CPUソケット数
CPU 　
筐体サイズ 2U
最大GPU数
電源仕様 リダンダント電源
用途/特長 　　　
製品説明

製品仕様

Dimensions (WxHxD, mm) 2U 4 Nodes - Front access
440 x 87.5 x 475
Motherboard MZ12-HD0
CPU AMD EPYC™ 7002 series processor family
Single processor, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 225W, cTDP up to 240W

Compatible with AMD EPYC™ 7001 series processor family
Socket Per Node:
1 x LGA 4094
Total:
4 x LGA 4094
Socket SP3
Chipset System on Chip
Memory Per node:
8 x DIMM slots

Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Memory speed: Up to 3200 MHz
LAN Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port

Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
Video Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Audio -
Storage Per node:
1 x 2.5" NVMe hot-swappable SSD bays

Total:
4 x 2.5" NVMe hot-swappable SSD bays

All storage bays are compatible with SATA devices
RAID -
Peripheral Drives -
Expansion Slots Per node:
1 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
1 x Low profile half-length slots with PCIe x16 (Gen3 x16 bus)
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)

2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards

Total:
4 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
4 x Low profile half-length slots with PCIe x16 (Gen3 x16 bus)
4 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)

8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
Internal I/O Per node:
2 x M.2 slot
1 x USB 3.0 header
1 x TPM header
1 x OCP 2.0 mezzanine slots
1 x Front panel header
1 x Back plane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
Front I/O Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x Reset button
Rear I/O Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
Backplane I/O 4 x ports
Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s or PCIe Gen3 x4 per port
TPM 1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply 2 x 1200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-240V~/ 12-7A, 50-60Hz
DC Input:
- 240Vdc/ 6A

DC Output:
- Max 1000W/ 100-240V~
+12V/ 80.5A
+12Vsb/ 3A
- Max 1200W/ 200-240V~ or 240Vdc input
+12V/ 97A
+12Vsb/ 3A
System Management Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • JAVA Based Serial Over LAN
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility Windows Server 2016 ( X2APIC/256T not supported)
Windows Server 2019

Red Hat Enterprise Linux 7.6 ( x64) or later
Red Hat Enterprise Linux 8.0 ( x64) or later

SUSE Linux Enterprise Server 12 SP4 ( x64) or later
SUSE Linux Enterprise Server 15 SP1 ( x64) or later

Ubuntu 16.04.6 LTS (x64) or later
Ubuntu 18.04.3 LTS (x64) or later

VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
Weight Net Weight: 19.7 kg
Gross Weight: TBD kg
System Fans 3 x 80x80x38mm (16,300rpm)
1 x 40x40x28mm (25,000rpm)
Operating Properties Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions 857 x 670 x 280 mm
Packaging Content 1 x H242-Z11
4 x CPU heatsinks
1 x Rail Kit
Part Numbers Barebone package: 6NH242Z11MR-00
Spare parts:
- Motherboard: 9MZ12HD0NR-00
- Rail kit: 25HB2-AA6107-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Back plane board: 9CBPH043NR-00
- Power Supply: 25EP0-212007-F3S
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