製品情報

H270-F4G (rev. 1.0)

製品種別 サーバ
CPUソケット数
CPU  
 
筐体サイズ 2U
最大GPU数
電源仕様
用途/特長
製品説明

製品仕様

Dimensions (WxHxD, mm) 2U 447 x 87.2 x 780
Motherboard MH70-HD0
CPU Intel® Xeon® E5-2600 V3 processorsNOTE: If only 1 CPU is installed, some PCIe, memory, network or I/O functions might be unavailable.
Socket Per node: 2 x LGA 2011-3Total: 8 x LGA 2011-3 Mounting pitch: narrow ILM (56x94mm)Max. length of M4 screw threads: 3.7mmScrews longer than 3.7mm might damage the motherboard
Chipset Intel® C612
Memory Per node: 16 x DIMM slotsTotal: 64 x DIMM slotsDDR4 memory supported only Quad channel memory architecture ECC RDIMM / LRDIMM modules supported Single and dual rank RDIMM modules up to 32GB supported Quad rank LRDIMM modules up to 64GB supported 1.2V modules: 1600/1866/2133 MHz
LAN 2 x 10GbE with QSFP+ LAN port (Intel® 82599ES) 1 x 40GbE QSFP+ LAN port (Intel® XL710-AM1) (in option) 1 x 10/100/1000 management LAN
Video Integrated in Aspeed® AST2400 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp
Audio -
Storage Per node: 4 x 2.5" hot-swappable HDD/SSD baysTotal: 16 x 2.5" hot-swappable HDD/SSD bays
SATA Per node: 6 x SATA III 6Gb/s portsTotal: 24 x SATA III 6Gb/s ports
SAS -
RAID Intel® SATA RAID 0/1/5/10
Peripheral Drives -
Expansion Slots Per node: 1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus) connector 1 x Mezzanine PCIe x8 (Gen3 x8 bus) connectorTotal: 4 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) connectors 4 x Mezzanine PCIe x8 (Gen3 x8 bus) connectors
Internal I/O Per node: 2 x 18-pin power connectors 6 x SATA III 6Gb/s ports 1 x USB 3.0 header 1 x Serial header 1 x VGA header 1 x TPM header 1 x Front panel header 1 x SATA SGPIO header 1 x BMC SGPIO header 1 x JTAG BMC header 1 x Software RAID jumper 1 x Clear CMOS jumper 1 x Power on selection jumper 1 x ACK selection jumper 1 x IPMB connector
Front I/O Per node: 2 x USB 3.0 1 x VGA 1 x Power button with LED 1 x ID button with LEDTotal: 8 x USB 3.0 4 x VGA 4 x Power buttons with LED 4 x ID buttons with LED
Rear I/O Per node: 2 x USB 3.0 1 x VGA 1 x Serial 1 x QSFP+ 1 x RJ45 1 x Power button with LED 1 x ID button with LED 1 x NMI button 1 x Reset button 1 x System status LED 2 x LAN activity LEDsTotal: 8 x USB 3.0 4 x VGA 4 x Serial 4 x QSFP+ 4 x RJ45 4 x Power buttons with LED 4 x ID buttons with LED 4 x NMI buttons 4 x Reset buttons 4 x System status LEDs 8 x LAN activity LEDs
Backplane I/O 4 x SAS/SATA 6Gb/s ports
TPM 1 x TPM header
Power Supply 2 x 1600W redundant PSU 80 PLUS Platinum AC input: - 100-127V/ 12A, 47-63Hz - 200-240V/ 9.48A, 47-63Hz DC output: - 1000W@100-127V - 1600W@200-240V
System Management Aspeed® AST2400 management controller Avocent® MergePoint IPMI 2.0 web interface:Network settings Network security settings Users control Services settings IPMI settings Sessions control LDAP settings Power control Voltages, fans and temperatures monitoring System event log Events management (platform events, trap settings, email settings) Serial Over LAN vKVM & vMedia (launch, configuration)
OS Supported Windows Server 2008 R2 (x64) Windows Server 2012 (x64) Windows Server 2012 R2 (x64) Red Hat Enterprise Linux 6.5 (x64) Red Hat Enterprise Linux 6.6 (x64) Red Hat Enterprise Linux 7.0 (x64) SUSE Linux Enterprise Server 11 SP3 (x64) SUSE Linux Enterprise Server 12 (x64) VMware ESXi 5.1 U2 VMware ESXi 5.5 U2 VMware ESXi 6.0
Weight 38kg
System Fans 16 x 40x40x56mm (23’000rpm)
Operating Properties Operating temperature: 10°C to 35°C Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions 1050x591x218mm
Part Numbers Barebone: 6NH270F4GMR-00 Rail kit: 25HB2-A86100-K0R
Packaging Content 1 x Driver CD 8 x CPU heatsinks 1 x User manual 1 x Rail Kit