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    6U8M-TURIN2 SYN MI350X

    5U以上 EPYC9005EPYC9004 8GPU リダンダント電源 GPUサーバー

    • 1. 930 x 448 x 264.7mm (36.6" x 17.6" x 10.4")
    • 2. TDP 最大500W
    • 3. 6Uラックマウント、6+2フェーズ、80-PLUS Titanium認証、3000W CRPS
    • 4. AMD Instinct™ MI350Xプラットフォーム、Infinity Fabric™リンク搭載
    • 5. PCIeスイッチ合成モードによるGPU-CPU間、GPUDirect RDMA NIC、GPUDirect Storageの最適化パフォーマンス
    • 6. デュアルソケット SP5 (LGA 6096)、AMD EPYC™ 9005/9004 (AMD 3D V-Cache™ テクノロジー搭載) および 97x4 シリーズ プロセッサー対応
    • 7. 12+12 DIMM スロット (1DPC)、DDR5 RDIMM、RDIMM-3DS 対応
    • 8. 8 HHHL PCIe5.0 x16、1 FHHL PCIe5.0 x16
    • 9. PCIeスイッチ接続 8基のホットスワップ対応2.5インチNVMe (PCIe5.0 x4) ドライブベイ
    • 10. CPU接続 4基のホットスワップ対応2.5インチNVMe (PCIe5.0 x4) ドライブベイ
    • 11. 1基のM.2 (PCIe3.0 x4 または SATA 6Gb/s)、1基のM.2 (PCIe3.0 x4 または SATA 6Gb/s) をサポート
    • 12. Intel® i350-AM2 による2基のRJ45 (1GbE)
    • 13. リモート管理 (IPMI)

    製品仕様

     System
    Form Factor 6U Rackmount
    Dimensions 930 x 448 x 264.7mm (36.6” x 17.6” x 10.4”)
    Support MB TURIN2D24G-2L+/500W
     Front Panel
    Buttons Power button w/ LED, Reset button, NMI button, UID button
    LEDs System fault LED, HDD activity LED
    I/O Ports 2 RJ45 (1GbE) by Intel i350, shares with Rear IO
    1 dedicated IPMI, shares with Rear IO
    4 Type-A (USB3.2 Gen1)
    1 DB15 (VGA)
     External Drive Bay / Storage
    Front Side Drive Bay 8 Hot-swap 2.5″ NVMe (PCIe5.0 x4) drive bays from PCIe Switch
    4 Hot-swap 2.5″ NVMe (PCIe5.0 x4) drive bays from CPU
    Internal Side 1 M-key (PCIe3.0 x4 or SATA 6Gb/s), supports 22110/2280 form factor [CPU0]
    1 M-key (PCIe3.0 x4 or SATA 6Gb/s), supports 22110/2280 form factor [CPU1]
     Power Supply
    Type 6+2 CRPS
    Output Watts 3002.4W @ 220-240Vac input, 2900W @200-220Vac input
    Efficiency 80-PLUS Titanium
    AC Input 200-240Vrms, 50/60Hz
     System Fan
    Fan 21 PWM Hot-swap 80×80 mm fans
     Processor System
    GPU AMD Instinct™ MI350X platform with Infinity Fabric™ Links
    CPU Supports AMD EPYC™ 9005/9004 (with AMD 3D V-Cache™ Technology) and 97×4 series processors
    Socket Dual Socket SP5 (LGA 6096)
    Thermal Design Power Up to 500W
    Chipset System on Chip
     System Switch Board
    Switch IC PEX89104
    Topology Synthetic mode for optimized performance of GPU-to-CPU, GPUDirect RDMA NIC, and GPUDirect Storage
     System Memory
    Supported DIMM Quantity 12+12 DIMM slots (1DPC)
    Supported Type Supports DDR5 288-pin RDIMM, RDIMM-3DS
    Max. Capacity per DIMM RDIMM: 128GB (2Rx4)
    RDIMM-3DS: 256GB (2Rx4)
    Max. DIMM Frequency 6400 MHz
    Voltage 1.1V
     PCIe Expansion Slots
    PCIe x 16 Rear:
    8 HHHL PCIe5.0 x16
    1 FHHL PCIe5.0 x16
     Ethernet
    Additional GbE Controller Intel® i350: 2 RJ45 (1GbE)
     Server Management
    BMC Controller ASPEED AST2600
    IPMI Dedicated GLAN 1 Realtek RTL8211F for dedicated management GLAN
     Graphics
    Controller ASPEED AST2600
    VRAM DDR4 512MB
     Rear I/O
    UID Button/LED 1 UID button w/ LED
    Other Button/LED 1 PWR button, 1 RST button, 1 NMI button, 1 HDD LED, 1 SYS LED
    Video Port 1 DB15 (VGA)
    USB 3.2 Gen1 Port 2 Type-A (USB3.2 Gen1)
    RJ45 2 RJ45 (1GbE) by Intel® i350, shares with Front Panel
    1 dedicated IPMI, shares with Front Panel
     System BIOS
    BIOS Type AMI UEFI BIOS; 256 Mb (32MB) SPI Flash ROM
    BIOS Features ASRock Rack Instant Flash, ACPI 6.4 and about compliance wake up events, SMBIOS 3.5.0 and above, Plug and Play(PnP)
     Hardware Monitor
    Temperature CPU, MB, Card side Temperature Sensing
    Fan Fan Tachometer
    CPU Quiet Fan (Allow Chassis Fan Speed Auto-Adjust by CPU Temperature)
    Fan Multi-Speed Control
    Voltage P0_VDDCR_CPU0, P0_VDDCR_CPU1, P0_VDDCR_SOC, P0_VDD_18_DUAL, P0_VDD_11_S3, P0_VDDIO, P1_VDDCR_CPU0, P1_VDDCR_CPU1, P1_VDDCR_SOC, P1_VDD_18_DUAL, P1_VDD_11_S3, P1_VDDIO, +BAT, +12V, +3VSB, +5VSB
     Environment
    Temperature Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C
    Humidity Non operation humidity: 20% ~ 90% ( Non condensing)

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