NEW

4U10G-TURIN2/RF

4U EPYC9005EPYC9004 10GPU リダンダント電源 GPUサーバー

1. 600W GPUおよびアクセラレータカードの信頼性の高い冷却を実現する強化されたエアフロー
2. 4Uラックマウント、3+1冗長構成の3200W CRPS搭載
3. デュアルソケットSP5 (LGA 6096)、AMD EPYC™ 9005/9004 (AMD 3D V-Cache™テクノロジー搭載) および97x4シリーズプロセッサをサポート
4. 12+12 DIMMスロット（1DPC）、DDR5 RDIMM、RDIMM-3DS対応
5. 16基のホットスワップ対応2.5インチNVMe（PCIe5.0 x4）ドライブベイ、または24基のホットスワップ対応2.5インチSATA/SAS*ドライブベイ *追加のRAID/HBAカードが必要
6. 10 FHFL デュアルスロット PCIe5.0 x16 + 2 FHFL シングルスロット PCIe5.0 x8（隣接デュアルスロットと共有スペース、PEX89104 PCIeスイッチ搭載）
7. 1 FHFL シングルスロット PCIe5.0 x16（CPUダイレクトリンク）、2 FHHL PCIe5.0 x16
8. 2基のM.2スロット対応（PCIe3.0 x4またはSATA 6Gb/s）
9. 1基 OCP NIC 3.0（PCIe5.0 x16）、2基 RJ45（1GbE）Intel® i350搭載
10. リモート管理（IPMI）

主な仕様

製品仕様

System
Form Factor	4U Rackmount
Dimensions	867 x 438 x 176.5 mm (34.1” x 17.2” x 6.9”)
Support MB	TURIN2D24G-2L+/500W
Front Panel
Buttons	Power button w/ LED, Reset button, NMI button, UID button
LEDs	System fault LED, HDD activity LED
I/O Ports	2 RJ45 (1GbE) by Intel i350, shares with Rear IO 1 dedicated IPMI, shares with Rear IO 4 Type-A (USB3.2 Gen1) 1 DB15 (VGA)
External Drive Bay / Storage
Front Side Drive Bay	16 Hot-swap 2.5″ NVMe (PCIe5.0 x4) drive bays or 24 Hot-swap 2.5″ SATA/SAS* drive bays *Additional RAID/HBA card required to support the 24 x 2.5″ SATA/SAS drive bays
Front Side Backplane	24-port NVMe/SATA/SAS* passive backplanes *SAS drive is only supported with additional RAID/HBA cards
Internal Side	1 M-key (PCIe3.0 x4 or SATA 6Gb/s), supports 22110/2280 form factor [CPU0] 1 M-key (PCIe3.0 x4 or SATA 6Gb/s), supports 22110/2280 form factor [CPU1]
Power Supply
Type	3+1 CRPS
Output Watts	1000W @ 100-127Vac input / 3200W @ 200-240Vac input
Efficiency	80-PLUS Titanium
AC Input	Low-line: 100-127Vrms, 47/63Hz ; High-line: 200-240Vrms, 47/63Hz
System Fan
Fan	5 middle hot-swap 80×80 mm fans, 5 rear hot-swap 80×80 mm fans
Processor System
CPU	Supports AMD EPYC™ 9005/9004 (with AMD 3D V-Cache™ Technology) and 97×4 series processors
Socket	Dual Socket SP5 (LGA 6096)
Thermal Design Power	Up to 500W
Chipset	System on Chip
System Memory
Supported DIMM Quantity	12+12 DIMM slots (1DPC)
Supported Type	Supports DDR5 288-pin RDIMM, RDIMM-3DS
Max. Capacity per DIMM	RDIMM: 128GB (2Rx4) RDIMM-3DS: 256GB (2Rx4)
Max. DIMM Frequency	6400 MHz
Voltage	1.1V
PCIe Expansion Slots
PCIe x 16	Rear: 10 FHFL dual-slot PCIe5.0 x16 (with PEX89104 PCIe Switch) 1 FHFL single-slot PCIe5.0 x16 (CPU direct link) Front: 2 FHHL PCIe5.0 x16
PCIe x 8	Rear: 2 FHFL single-slot PCIe5.0 x8, shared space with adjacent dual-slot (with PEX89104 PCIe Switch)
Ethernet
Additional GbE Controller	Intel^® i350: 2 RJ45 (1GbE)
OCP slot	1 OCP NIC 3.0 (PCIe5.0 x16)
Server Management
BMC Controller	ASPEED AST2600
IPMI Dedicated GLAN	1 Realtek RTL8211F for dedicated management GLAN
Graphics
Controller	ASPEED AST2600
VRAM	DDR4 512MB
Rear I/O
UID Button/LED	1 UID button
Video Port	1 DB15 (VGA)
USB 3.2 Gen1 Port	2 Type-A (USB3.2 Gen1)
RJ45	2 RJ45 (1GbE) by Intel i350, shares with Front Panel 1 dedicated IPMI, shares with Front Panel
System BIOS
BIOS Type	AMI UEFI BIOS; 256 Mb (32MB) SPI Flash ROM
BIOS Features	ASRock Rack Instant Flash, ACPI 6.4 and about compliance wake up events, SMBIOS 3.5.0 and above, Plug and Play(PnP)
Hardware Monitor
Temperature	CPU, MB, Card side Temperature Sensing
Fan	Fan Tachometer CPU Quiet Fan (Allow Chassis Fan Speed Auto-Adjust by CPU Temperature) Fan Multi-Speed Control
Voltage	P0_VDDCR_CPU0, P0_VDDCR_CPU1, P0_VDDCR_SOC, P0_VDD_18_DUAL, P0_VDD_11_S3, P0_VDDIO, P1_VDDCR_CPU0, P1_VDDCR_CPU1, P1_VDDCR_SOC, P1_VDD_18_DUAL, P1_VDD_11_S3, P1_VDDIO, +BAT, +12V, +3VSB, +5VSB
Environment
Temperature	Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C
Humidity	Non operation humidity: 20% ~ 90% ( Non condensing)