NEW
H253-Z10-LAP1
高密度サーバー - AMD EPYC™ 9005/9004 - 2U 4ノード UP 8ベイ E1.S Gen4 NVMe DLC
2U EPYC9005EPYC9004 リダンダント電源 汎用サーバー 仮想化サーバー マルチノード 水冷
- 1. ダイレクト液体冷却ソリューション
- 2. 2U 4ノード フロントアクセスサーバーシステム
- 3. ノードあたりシングルAMD EPYC™ 9005/9004シリーズプロセッサー
- 4. 12チャネルDDR5 RDIMM、ノードあたり24 x DIMM
- 5. デュアルROMアーキテクチャ
- 6. Intel® I350-AM2経由の8 x 1Gb/s LANポート
- 7. CMCポート×2
- 8. E1.S Gen4 NVMeホットスワップベイ×8
- 9. PCIe Gen5 x4およびSATAインターフェース搭載M.2スロット×12
- 10. OCP NIC 3.0 PCIe Gen5 x16スロット×4
- 11. デュアル3000W 80 PLUS Titanium認定冗長電源
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対応製品
製品仕様
| Dimensions (WxHxD, mm) | 2U 4-Node – Front access 447 x 86.8 x 902 |
|---|---|
| Motherboard | MZ13-SH0 |
| CPU | AMD EPYC™ 9005 Series Processors AMD EPYC™ 9004 Series Processors Single processor per node, cTDP up to 500W |
| Socket | 4 x LGA 6096 Socket SP5 |
| Chipset | System on Chip |
| Memory | 96 x DIMM slots DDR5 memory supported 12-Channel memory per processor AMD EPYC™ 9005: AMD EPYC™ 9004: |
| LAN |
Front:
8 x 1Gb/s LAN (4 x Intel® I350-AM2) – Support NCSI function 4 x 10/100/1000 Mbps Management LAN Rear: [Note] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology. |
| Video | Integrated in ASPEED® AST2600 x 4 – 4 x Mini-DP |
| Storage | Front hot-swap: 8 x 9.5mm E1.S Gen4 NVMe Internal M.2: |
| SAS | N/A |
| RAID | N/A |
| PCIe Expansion Slots | 4 x OCP NIC 3.0 (Gen5 x16) – Support NCSI function |
| Front I/O | 8 x USB 3.2 Gen1 ports (Type-A) 4 x Mini-DP 8 x RJ45 ports 4 x MLAN ports 4 x Power buttons with LED 4 x ID buttons with LED 4 x Reset buttons 4 x System status LEDs |
| Rear I/O | 2 x CMC ports |
| Backplane Board | N/A |
| Security Modules | 1 x TPM header with SPI interface – Optional TPM2.0 kit: CTM010 |
| Power Supply | Dual 3000W 80 PLUS Titanium redundant power supply [1]
AC Input: DC Input: (Only for China) DC Output: [1] The system power supply requires C19 power cord. |
| System Management | ASPEED® AST2600 Baseboard Management Controller ASPEED® AST2520 Chassis Management Controller GIGABYTE Management Console web interface
|
| OS Compatibility | Please refer to OS compatibility table in support page
Additional certifications: |
| System Fans | 4 x 80x80x80mm |
| Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8% to 80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20% to 95% (non-condensing) [Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C. |
| Packaging Dimensions | 1181 x 718 x 336 mm |
| Packaging Content | 1 x H253-Z10-LAP1 4 x GIGABYTE CPU cold plate loops 1 x Mini-DP to D-Sub cable 1 x L-shape Rail kit |
| Part Numbers | – Barebone with cold plates: 6NH253Z10DR000LCP1* – Barebone without cold plates: 6NH253Z10DZ000LCP1* – Motherboard: 9MZ13SH0UR-000-3* – L-shape Rail kit: 25HB2-A86104-K0R – GIGABYTE CPU cold plate loop: 25ST7-20000J-J2R – Fan module: 25ST2-888020-S1R – EDSFF riser card – CRSH01X: 9CRSH01XNR-00* – CMC module – CMBH42: 9CMBH42NR-00* – Mini-DP to D-Sub cable: 25CRN-200801-K1R – Power supply: 25EP0-23000R-G1S Optional parts: – E1.S Latch with dummy tray (24 in 1): 6NH253Z10S1000AAP11 |




