H262-Z6B-ICP1

    高密度サーバー - AMD EPYC™ 7003/7002 - 2U 4ノード DP 8ベイ Gen4 NVMe/SATA 液冷冷却 3000W

    2U EPYC7003EPYC 7002 リダンダント電源 汎用サーバー クラウドサーバー 仮想化サーバー マルチノード

    • 1. 液浸冷却サーバー
    • 2. ハードウェアレベルの信頼の根源サポート
    • 3. 2U 4ノードフロントアクセスサーバーシステム
    • 4. ノードあたりデュアルAMD EPYC™ 7003/7002シリーズプロセッサー
    • 5. 8チャネルDDR4 RDIMM/LRDIMM、ノードあたり16 x DIMM
    • 6. Intel® I350-AM2経由の8 x 1Gb/s LANポート
    • 7. 1 x CMCポート
    • 8. 8 x 2.5インチ Gen4 NVMe/SATAホットスワップベイ
    • 9. 4 x M.2スロット(PCIe Gen4 x4インターフェース)
    • 10. 8 x LP PCIe Gen4 x16スロット
    • 11. 4 x OCP NIC 3.0 PCIe Gen4 x16スロット
    • 12. デュアル3000W 80 PLUS Titanium冗長電源ユニット

    オンサイトサポート
    対応製品

    製品仕様

    Dimensions (WxHxD, mm) 2U 4-Node – Front access
    440 x 87.5 x 840
    Motherboard MZ62-HD4 Rev. 3.0
    CPU AMD EPYC™ 7003 Series Processors
    AMD EPYC™ 7002 Series ProcessorsDual processor, TDP up to 280W

    [Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

    Socket 8 x LGA 4094
    Socket SP3
    Chipset System on Chip
    Memory 64 x DIMM slots
    DDR4 memory supported
    8-Channel memory per processor
    RDIMM/LRDIMM: Up to 3200 MT/s
    LAN Top:
    8 x 1Gb/s LAN (4 x Intel® I350-AM2)
    – Support NCSI function4 x 10/100/1000 Mbps Management LAN
    1 x CMC port
    Video Integrated in ASPEED® AST2500 x 4
    – 4 x Mini-DP
    Storage Bottom hot-swap:
    8 x 2.5″ Gen4 NVMe/SATA
    – (NVMe from CPU_1)
    – (SATA from CPU_0)Internal M.2:
    4 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0
    SAS N/A
    RAID N/A
    PCIe Expansion Slots Riser Card CRSH01E x 4:
    – 4 x LP x16 (Gen4 x16), from CPU_0Riser Card CRSH01H x 4:
    – 4 x LP x16 (Gen4 x16), from CPU_0

    4 x OCP NIC 3.0 (Gen4 x16), from CPU_0
    – Support NCSI function

    Top I/O 8 x USB 3.2 Gen1 ports (Type-A)
    4 x Mini-DP
    8 x RJ45 ports
    4 x MLAN ports
    4 x Power buttons with LED
    4 x ID buttons with LED
    4 x Reset buttons
    4 x System status LEDs
    4 x ID LEDs
    1 x CMC port
    1 x CMC status LED
    1 x CMC reset button
    Backplane Board Speed and bandwidth:
    PCIe Gen4 x4 or SATA 6Gb/s
    Security Modules 1 x TPM header with SPI interface
    Optional TPM2.0 kit: CTM010
    Power Supply Dual 3000W 80 PLUS Titanium power supply [1]

    AC Input:
    – 100-127V~/ 15.5A, 50-60Hz
    – 200-220V~/ 15.5A, 50-60Hz
    – 220-240V~/ 15.5A, 50-60Hz

    DC Input: (Only for China)
    – 240Vdc/ 15.5A

    DC Output:
    – Max 1000W/ 100-127V~
    +12.2V/ 81A
    +12Vsb/ 3A
    – Max 2600W/ 200-220V~
    +12.2V/ 213A
    +12Vsb/ 3A
    – Max 3000W/ 220-240V~ or 240Vdc Input
    +12.2V/ 245A
    +12Vsb/ 3A

    [1] The system power supply requires C19 power cord.

    System Management ASPEED® AST2500 Baseboard Management Controller
    ASPEED® AST2520 Chassis Management Controller
    GIGABYTE Management Console web interface

    • Dashboard
    • JAVA Based Serial Over LAN
    • HTML5 KVM
    • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
    • Sensor Reading History Data
    • FRU Information
    • SEL Log in Linear Storage / Circular Storage Policy
    • Hardware Inventory
    • Fan Profile
    • System Firewall
    • Power Consumption
    • Power Control
    • LDAP / AD / RADIUS Support
    • Backup & Restore Configuration
    • Remote BIOS/BMC/CPLD Update
    • Event Log Filter
    • User Management
    • Media Redirection Settings
    • PAM Order Settings
    • SSL Settings
    • SMTP Settings
    OS Compatibility Citrix Hypervisor 8.2.0 or later

    Red Hat Enterprise Linux 8.3 or later
    Red Hat Enterprise Linux 9.0 or later

    SUSE Linux Enterprise Server 12 SP5 or later
    SUSE Linux Enterprise Server 15 SP2 or later

    Ubuntu 18.04.5 LTS or later
    Ubuntu 20.04 LTS or later
    Ubuntu 22.04 LTS or later

    VMware ESXi 6.7 Update3 P03 or later
    VMware ESXi 7.0 Update1 or later
    VMware ESXi 8.0 or later

    Windows Server 2016 (X2APIC/256T not supported)
    Windows Server 2019
    Windows Server 2022

    Operating Properties Operating coolant temperature: 25°C to 35°C
    Non-operating temperature: -40°C to 60°C
    Non-operating humidity: 20%-95% (non-condensing)
    Packaging Dimensions 1180 x 779 x 300 mm
    Packaging Content 1 x H262-Z6B
    8 x CPU heatsinks
    Part Numbers – Barebone package: 6NH262Z6BRR000ICP1*
    – Motherboard: 9MZ62HD4NR-00*
    – CPU heatsink: 25ST1-443109-A3R/25ST1-44310A-A3R
    – Backplane board: 9CBPH082NR-00*
    – Riser card – CRSH01E: 9CRSH01ENR-00*
    – Riser card – CRSH01H: 9CRSH01HNR-00*
    – Power supply: 25EP0-23000E-G1SOptional parts:

    – C19 power cord 125V/15A (US): 25CP1-018000-Q0R
    – C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
    – M.2 expansion card – CMTP061: 9CMTP061NR-00*
    – Ring topology kit: 6NH262Z65SR-00-100

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