NEW
H174-A80-IAS1
高密度サーバー - Intel® Xeon® 6 プロセッサー - 1U 2ノード DP 4ベイ Gen5 NVMe/SATA/SAS-4 液浸冷却
1U Xeon6 6900P リダンダント電源 汎用サーバー クラウドサーバー 仮想化サーバー マルチノード
- 1. 液浸冷却サーバー
- 2. 1U 2ノードサーバーシステム
- 3. ノードあたりデュアルIntel® Xeon® 6900シリーズプロセッサー
- 4. 12チャネルDDR5 RDIMM / MRDIMM、ノードあたり24 x DIMM
- 5. デュアルROMアーキテクチャ
- 6. Intel® I350-AM2経由の4 x 1Gb/s LANポート
- 7. 4 x 2.5インチ Gen5 NVMe/SATA/SAS-4ベイ
- 8. 4 x LP PCIe Gen5 x16スロット
- 9. 1+1 3200W 80 PLUS Titanium 冗長電源ユニット
オンサイトサポート
対応製品
製品仕様
| Dimensions (WxHxD, mm) | 1U 2-Node 440 x 43.4 x 855 |
|---|---|
| Motherboard | MA84-HD0 |
| CPU | Intel® Xeon® 6 Processors – Intel® Xeon® 6900-Series ProcessorsDual processor per node, TDP up to 500W [Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable. |
| Socket | 4 x LGA 7529 Socket BR |
| Chipset | System on Chip |
| Memory | 48 x DIMM slots Support DDR5 RDIMM/MRDIMM [1] 12-Channel memory per processor RDIMM: Up to 6400 MT/s MRDIMM: Up to 8800 MT/s [1] MRDIMMs are only supported with Intel® Xeon® 6 Processors with P-cores. |
| LAN |
Top (I/O board – CLNP319 x 2):
4 x 1Gb/s LAN (2 x Intel® I350-AM2) – Support NCSI function2 x 10/100/1000 Mbps Management LAN [1] [1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology. |
| Video | Integrated in ASPEED® AST2600 x 2 – 2 x Mini-DP |
| Storage |
Bottom:
4 x 2.5″ Gen5 NVMe/SATA/SAS-4 [1] – (NVMe from CPU_1) [1] Storage card is required to support SATA and SAS drives. |
| SAS | Require SAS add-in cards |
| RAID | Require RAID add-in cards Onboard VROC key header |
| PCIe Expansion Slots | Riser Card CRCH010 x 4: – 4 x LP x16 (Gen5 x16), from CPU_0 |
| Top I/O | I/O board – CLNP319 x 2: 4 x USB 3.2 Gen1 ports (Type-A) 2 x Mini-DP 4 x RJ45 ports 2 x MLAN ports 2 x ID buttons with LED 2 x System status LEDs |
| Backplane Board | Speed and bandwidth: PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s |
| Security Modules | 2 x TPM headers with SPI interface – Optional TPM2.0 kit: CTM0122 x PRoT connectors (only enabled on RoT SKU) |
| Power Supply | 1+1 3200W 80 PLUS Titanium redundant power supplies [1]
AC Input: DC Input: (Only for China) DC Output: [1] The system power supply requires C19 power cord. |
| System Management | |
| OS Compatibility | Please refer to OS compatibility table in support page |
| Operating Properties | Operating coolant temperature: 20°C to 35°C Non-operating temperature: -40°C to 60°C Non-operating humidity: 20% to 95% (non-condensing) |
| Packaging Dimensions | 1187 x 733 x 281 mm |
| Packaging Content | 1 x H174-A80-IAS1 4 x CPU heatsinks 1 x Mini-DP to D-Sub cable 4 x Carriers |
| Part Numbers | – Barebone package: 6NH174A80DR000IAS1* – Motherboard: 9MA84HD0UR-000* – CPU heatsink: 25ST1-45320N-T1R – Backplane board – CBP2025: 9CBP2025NR-00* – Riser card – CRCH010: 9CRCH010NR-00* – I/O board – CLNP319: 9CLNP319NR-00* – Mini-DP to D-Sub cable: 25CRN-200801-K1R – Power supply: 25EP0-232004-G1S |
