NEW
H274-S61-IAW1
高密度サーバー - Intel® Xeon® 6 プロセッサー - 2U 4ノード DP 8ベイ Gen5 NVMe/SATA/SAS-4 液浸冷却
2U Xeon6 6500PXeon6 6700P リダンダント電源 汎用サーバー クラウドサーバー 仮想化サーバー マルチノード
- 1. 液浸冷却サーバー
- 2. 2U 4ノードサーバーシステム
- 3. ノードあたりデュアルIntel® Xeon® 6700/6500シリーズプロセッサー
- 4. 8チャネルDDR5 RDIMM / MRDIMM、ノードあたり16 x DIMM
- 5. デュアルROMアーキテクチャ
- 6. Intel® I350-AM2経由の8 x 1Gb/s LANポート
- 7. 8 x 2.5インチ Gen5 NVMe/SATA/SAS-4ベイ
- 8. PCIe Gen4 x4インターフェース搭載 M.2スロット 4基（オプション）
- 9. LP PCIe Gen5 x16スロット 8基
- 10. OCP NIC 3.0 PCIe Gen5 x16スロット 4基
- 11. デュアル 3000W 80 PLUS Titanium 冗長電源ユニット
オンサイトサポート
対応製品
製品仕様
| Dimensions (WxHxD, mm) | 2U 4-Node 440 x 87.5 x 877 |
|---|---|
| Motherboard | MS64-HD0 |
| CPU | Intel® Xeon® 6 Processors – Intel® Xeon® 6700-Series Processors – Intel® Xeon® 6500-Series ProcessorsDual processor per node, TDP up to 350W [Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable. |
| Socket | 8 x LGA 4710 Socket E2 |
| Chipset | System on Chip |
| Memory | 64 x DIMM slots Support DDR5 RDIMM/MRDIMM [1] 8-Channel memory per processor RDIMM: Up to 6400 MT/s MRDIMM: Up to 8000 MT/s [1] MRDIMMs are only supported with Intel® Xeon® 6 Processors with P-cores. |
| LAN |
Top (I/O board – CLBH160 x 4):
8 x 1Gb/s LAN (4 x Intel® I350-AM2) – Support NCSI function4 x 10/100/1000 Mbps Management LAN [1] [1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology. |
| Video | Integrated in ASPEED® AST2600 x 4 – 4 x Mini-DP |
| Storage |
Bottom:
8 x 2.5″ Gen5 NVMe/SATA/SAS-4 [1] – (NVMe & SATA from CPU_1)Optional internal M.2 (CMTP160 x 4): 4 x M.2 (2260/2280/22110), PCIe Gen4 x4, from CPU_1 [1] SAS card is required to support SAS drives. |
| SAS | Require SAS add-in cards |
| RAID | Require RAID add-in cards Onboard VROC key headers |
| PCIe Expansion Slots | Riser Card CRSH01Q x 4: – 4 x LP x16 (Gen5 x16), from CPU_0Riser Card CRSH01R x 4: – 4 x LP x16 (Gen5 x16), from CPU_0 4 x OCP NIC 3.0 (Gen5 x16), from CPU_0 |
| Top I/O | I/O board – CLBH160 x 4: 8 x USB 3.2 Gen1 ports (Type-A) 4 x Mini-DP 8 x RJ45 ports 4 x MLAN ports 4 x System status LEDs |
| Backplane Board | Speed and bandwidth: PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s |
| Security Modules | 4 x TPM headers with SPI interface – Optional TPM2.0 kit: CTM0124 x PRoT connectors (only enabled on RoT SKU) |
| Power Supply | Dual 3000W 80 PLUS Titanium redundant power supply [1]
AC Input: DC Input: (Only for China) DC Output: [1] The system power supply requires C19 power cord. |
| System Management | |
| OS Compatibility | |
| Operating Properties | Operating coolant temperature: 20°C to 35°C Non-operating temperature: -40°C to 60°C Non-operating humidity: 20% to 95% (non-condensing) |
| Packaging Dimensions | 1184 x 706 x 394 mm |
| Packaging Content | 1 x H274-S61-IAW1 8 x CPU heatsinks 1 x Mini-DP to D-Sub cable 16 x Carriers |
| Part Numbers | – Barebone package: 6NH274S61DR000IAW1* – Motherboard: 9MS64HD0UR-000* – CPU heatsink: 25ST1-453219-C1R – Front panel board – CFPH004: 9CFPH004NR-00* – Backplane board – CBPH081: 9CBPH081NR-00* – Riser card – CRSH01Q: 9CRSH01QNR-00* – Riser card – CRSH01R: 9CRSH01RNR-00* – I/O board – CLBH160: 9CLBH160NR-00* – Mini-DP to D-Sub cable: 25CRN-200801-K1R – Power supply: 25EP0-23000K-L0SOptional parts: – M.2 riser card – CMTP160: 9CMTP160NR-00* |
