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    X12DGO-6

    第3世代 Xeon Scalable

    製品仕様

    Product SKUs
    MBD-X12DGO-6 X12DGO-6
    Physical Stats
    Form FactorProprietary
    Dimensions 15.09" x 16.85" (38.33cm x 42.8cm)
    Processor/Cache
    CPU 3rd Gen Intel® Xeon® Scalable processors
    Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
    System Memory
    Memory Capacity Up to 8TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 8TB 3DS ECC LRDIMM, DDR4-3200MHz
    Up to 8GB Unbufferred ECC Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 32 DIMM slots
    Memory Type N/A
    DIMM Sizes RDIMM: 256GB
    LRDIMM: 256GB
    Memory Voltage 1.2V
    On-Board Devices
    Chipset Intel® C621A
    IPMI ASPEED AST2600 BMC
    Network Controllers N/A
    Input / Output
    SATA 8 SATA3 (6Gbps) ports
    USB3 USB 3.1 Gen2 ports , 1 via header, 2 Type A)3 USB 3.2 Gen2 ports , 1 via header) + 2 Type A
    Video Output1 VGA port
    Serial Port / Header1 COM Port (1 header)
    TPM1 TPM Header
    Expansion Slots
    PCI-E 3 PCI-E 4.0 x16
    M.2M.2 Interface: 2 PCI-E 4.0 x4
    Form Factor: 2280/22110
    System BIOS
    BIOS Type AMI UEFI
    Management
    Software Intel® Node Manager, IPMI (Intelligent Platform Management Interface) v2.0 with KVM support, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor® 5, SuperDoctor® III, Watchdog
    System Management SoftwareIPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
    Power ConfigurationsACPI Power Management
    Power supply monitoring
    PC Health Monitoring
    Voltage +3.3V, +5V, 3.3V standby, CPU, CPU temperature, CPU thermal trip support, Memory temperature, Memory Voltages, PCH temperature, System temperature, VBAT, VRM temperature
    Temperature N/A
    LED N/A
    Other Features N/A

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