製品情報

H261-NO0 (rev. 100)

製品種別 サーバ
CPUソケット数
CPU  
 
筐体サイズ 2U
最大GPU数
電源仕様 リダンダント電源
用途/特長   
製品説明

製品仕様

Dimensions (WxHxD, mm) 2U 4 Nodes - Rear access
440 x 87 x 840
Motherboard MH61-HD6
CPU 2nd Generation Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor
CPU TDP up to 165W
NOTE:
* If only 1 CPU is installed, some PCIe or memory functions might be unavailable

* This device does not support Intel Omni-Path function
Socket Per Node:
2 x LGA 3647
Total:
8 x LGA 3647
Socket P
Chipset Intel® C621 Express Chipset
Memory Per node:
16 x DIMM slots

Total:
64 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933( 1DPC)/2666/2400/2133 MHz

Maximum verified DCPMM configuration:

* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)

DCPMM installation locations:
DIMM_P1_( G1, J1)

NOTE:
1. 2933MHz for 2nd Generation Intel® Xeon® Scalable Processors only
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative
LAN Per node:
1 x Dedicated management port

Total:
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port

* CMC: Chassis Management Controller, to monitor all status of computing nodes
* Please contact FAE if NCSI function of OCP mezzanine card is needed
Video Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Audio -
Storage Per node:
6 x U.2 hot-swappable bays
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)

Total:
- 24 x U.2 hot-swappable bays
RAID For SATA drives:
Intel® SATA RAID 0/1/5/10
For U.2 drives:
Intel® Virtual RAID On CPU (VROC) RAID 0, 1, 10, 5
Note:
1) VROC module is compatible for Intel®SSD only
2) Default 1 PCS VROC module for one 2U 4 Nodes server system
Peripheral Drives -
Expansion Slots Per node:
Riser Card CRSH010:
- 1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus)

Riser Card CRSH011:
- 1 x Half-length low-profile slots with PCIe x8 (Gen3 x8 bus)

1 x OCP mezzanine slot with PCIe Gen3 x16 bus

Total:
4 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus)
4 x Half-length low-profile slots with PCIe x8 (Gen3 x8 bus)
4 x OCP mezzanine slots with PCIe Gen3 x16 bus
Internal I/O Per node:
1 x COM header
2 x SATA 7-pin connectors
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
Front I/O Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x Reset button

*1 x CMC Status LED
*1 x CMC Reset button

*Only one CMC Status LED and Reset button per system
Rear I/O Per node:
2 x USB 3.0
1 x VGA
1 x RJ45 MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
4 x RJ45 MLAN
4 x ID LEDs
*1 x CMC global management port

*Only one CMC global management port per system
Backplane I/O 24 x ports
PCIe Gen3 x4 U.2 port
TPM 1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
Power Supply 2 x 2200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V
+12.12V/ 178.1A
+12Vsb/ 3.5A

NOTE:
* The system power supply requires C19 type power cord
System Management Aspeed® AST2500 management controller
AMI MegaRAC SP-X Solution Web interface

  • Dashboard
  • JAVA Based Serial Over LAN
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility For Skylake processors:

Windows Server 2012 R2 (x64) Update1
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 (x64) or later
Red Hat Enterprise Linux 7.3 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later

SUSE Linux Enterprise Server 11.4 (x64) or later
SUSE Linux Enterprise Server 12.2 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 16.04.1 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0

For Cascade Lake processors:

Windows Server 2012 R2 (x64) Update1
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later

SUSE Linux Enterprise Server 12.3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 18.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0
Weight Net Weight: 27.3 kg
Gross Weight: 45.92 kg
System Fans 8 x 80x80x38mm (16,300rpm)
Operating Properties Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions 1180 x 779 x 300 (mm)
Packaging Content 1 x H261-NO0
8 x CPU heatsinks
1 x Rail Kit
1 x VROC module
8 x Non-Fabric CPU carrier
Part Numbers Barebone package: 6NH261NO0MR-00
Spare parts:
- Motherboard: 9MH61HD6NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- Back plane board: 9CBPH0O4NR-00
- Power Supply: 25EP0-222003-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional)
- Ring topology kit: 6NH262Z65SR-00-100 (optional extra)